公开(公告)号：US20240355737A1

公开(公告)日：2024-10-24

申请号：US18304001

申请日：2023-04-20

Applicant: Cisco Technology, Inc.

Inventor： Wenbin Ma ,  Mike Sapozhnikov ,  Weiying Ding ,  David Nozadze ,  Yinxin Yang

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L23/5286 ,  H01L21/76898 ,  H01L23/481

Abstract: In some aspects, the techniques described herein relate to an apparatus including: a semiconductor device substrate material; a first signal conductor incorporated into the semiconductor device substrate material; a second signal conductor incorporated into the semiconductor device substrate material; and a ground conductor incorporated into the semiconductor device substrate material between the first signal conductor and the second signal conductor, wherein the ground conductor includes a first elongated portion and a second elongated portion arranged at an angle relative to the first elongated portion.