公开(公告)号：US11465248B1

公开(公告)日：2022-10-11

申请号：US17365275

申请日：2021-07-01

Applicant: Cisco Technology, Inc.

Inventor： Yaotsan Tsai ,  Yongguo Chen ,  Zefeng Zhang ,  Hua Yang ,  Vic Hong Chia

IPC: B23P15/26

Abstract: Presented herein is a system including a cold plate configured to thermally couple to a heat source and conduct heat from the heat source to a fluid. A heat exchanger fluidly coupled to the cold plate is configured to dissipate heat from the fluid. A first pump and a second pump are configured to induce a flow in the fluid, and a reservoir is configured to store at least a portion of the fluid. A manifold is directly fluidly coupled to each of the cold plate, the heat exchanger, an inlet and an outlet of the first pump, an inlet and an outlet of the second pump and an inlet and an outlet of the reservoir.