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公开(公告)号：US20220312636A1
公开(公告)日：2022-09-29
申请号：US17498164
申请日：2021-10-11
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Yongguo Chen , Yaotsan Tsai , Hua Yang , Xin Mao
Abstract: A fan silencer module includes a housing having a first end of the housing, a second end of the housing, and an interior surface between the first end of the housing and the second end of the housing. Acoustic absorbing material is disposed on the interior surface. A honeycomb air flow director is disposed at the second end of the housing. And an electromagnetic interference gasket surrounds an outer edge of the honeycomb air flow director. In an embodiment, a depth of the electromagnetic interference gasket is at least as deep as a depth of the honeycomb air flow director. Also provided is a handle, and a latch actuator, to enable removal and replacement of the fan silencer module and an associated fan module from a chassis.
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2.发明申请POWER DOUBLER AMPLIFIER MODULE WITH IMPROVED SOLDER COVERAGE BETWEEN A HEAT SINK AND A THERMAL PAD OF A CIRCUIT PACKAGE 有权电源双极放大器模块，具有改进的散热片与散热片与热电偶套管之间的焊接覆盖公开(公告)号：US20150124410A1
公开(公告)日：2015-05-07
申请号：US14074057
申请日：2013-11-07
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Hujiao Wang , David A. Holtzclaw , Wei Qi , Benjamin Lee Davis , John MacKay
IPC: H05K7/20
CPC classification number: H01L23/3675 , H01L23/13 , H01L23/4006 , H01L23/42 , H01L2023/405 , H01L2023/4068 , H01L2924/0002 , H01L2924/00
Abstract: In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.
Abstract translation: 在一个实施例中，装置包括印刷电路板和安装到印刷电路板的电路封装。 电路封装有一个散热垫。 模块的第一散热器结构与印刷电路板相关联并且具有限定与热垫接触并热耦合的接触表面的壁。 墙壁至少包括一个孔。 在接触表面和热垫之间提供焊膏以将接触表面粘合到热垫上，其中至少一个孔被构造和布置成有助于使焊膏脱气。
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公开(公告)号：US20240102491A1
公开(公告)日：2024-03-28
申请号：US18353596
申请日：2023-07-17
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Peter Christopher McLean , Vic Hong Chia , Zahid Naveed Aziz , Harvey Yang
CPC classification number: F04D29/644 , F04D29/522 , H05K7/20718
Abstract: Various devices, systems, and methods are described herein that provide bi-directional, and even multi-directional airflow within fan systems. These fan systems can be utilized by devices such as datacenter switches to change from one direction of airflow (such as port side inlet) to another direction (such as port side exhaust). This can be done manually by having a multi-directional fan housed within an enclosure that provides access through a hatch door. The multi-directional fan can be removed and reoriented to a second direction, thus providing airflow with the same quality and pressure in multiple directions. Fan changes can also be automated through one or more interlocking rotational gears coupled to the fans within a housing, such that rotating one gear will rotate each of the fans within the housing, thus changing the direction of the airflow. By doing this, only one fan is needed to provide airflow in multiple directions.
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公开(公告)号：US11778725B2
公开(公告)日：2023-10-03
申请号：US17524364
申请日：2021-11-11
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: H05K1/0204 , H05K1/021 , H05K7/20336
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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公开(公告)号：US20230147492A1
公开(公告)日：2023-05-11
申请号：US17524364
申请日：2021-11-11
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: H05K1/0204 , H05K1/021 , H05K7/20336
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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Patent Agency Ranking
公开(公告)号：US20220354019A1
公开(公告)日：2022-11-03
申请号：US17242722
申请日：2021-04-28
Applicant: Cisco Technology, Inc.
Inventor： Yaotsan Tsai , Yongguo Chen , Hua Yang , Vic Hong Chia
IPC: H05K7/20
Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.
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公开(公告)号：US11465248B1
公开(公告)日：2022-10-11
申请号：US17365275
申请日：2021-07-01
Applicant: Cisco Technology, Inc.
Inventor： Yaotsan Tsai , Yongguo Chen , Zefeng Zhang , Hua Yang , Vic Hong Chia
IPC: B23P15/26
Abstract: Presented herein is a system including a cold plate configured to thermally couple to a heat source and conduct heat from the heat source to a fluid. A heat exchanger fluidly coupled to the cold plate is configured to dissipate heat from the fluid. A first pump and a second pump are configured to induce a flow in the fluid, and a reservoir is configured to store at least a portion of the fluid. A manifold is directly fluidly coupled to each of the cold plate, the heat exchanger, an inlet and an outlet of the first pump, an inlet and an outlet of the second pump and an inlet and an outlet of the reservoir.
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公开(公告)号：US20250059984A1
公开(公告)日：2025-02-20
申请号：US18938001
申请日：2024-11-05
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Peter Christopher McLean , Vic Hong Chia , Zahid Naveed Aziz , Harvey Yang
Abstract: Various devices, systems, and methods are described herein that provide bi-directional, and even multi-directional airflow within fan systems. These fan systems can be utilized by devices such as datacenter switches to change from one direction of airflow (such as port side inlet) to another direction (such as port side exhaust). This can be done manually by having a multi-directional fan housed within an enclosure that provides access through a hatch door. The multi-directional fan can be removed and reoriented to a second direction, thus providing airflow with the same quality and pressure in multiple directions. Fan changes can also be automated through one or more interlocking rotational gears coupled to the fans within a housing, such that rotating one gear will rotate each of the fans within the housing, thus changing the direction of the airflow. By doing this, only one fan is needed to provide airflow in multiple directions.
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公开(公告)号：US12156324B2
公开(公告)日：2024-11-26
申请号：US18361636
申请日：2023-07-28
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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公开(公告)号：US20230392873A1
公开(公告)日：2023-12-07
申请号：US17831921
申请日：2022-06-03
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: F28D15/0266 , F28D15/04 , F28D2015/0216
Abstract: A vapor chamber for a heatsink comprises: a housing having an exterior surface with an area to be positioned adjacent to a heat source, an interior surface to enclose contiguous chambers including an evaporator chamber adjacent to the area, a condenser chamber spaced from the evaporator chamber, and a connector chamber connecting the evaporator chamber to the condenser chamber, and interior walls that partition the contiguous chambers into channels that extend from their open near ends adjacent to the evaporator chamber into the condenser chamber, to provide fluid communication between the evaporator chamber and the condenser chamber; a wick on interior surfaces of the housing and on walls of the channels; and a working fluid in the contiguous chambers to circulate between the evaporator chamber and the condenser chamber via the channels to transfer heat away from and cool the heat source.
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