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公开(公告)号：US20250060069A1
公开(公告)日：2025-02-20
申请号：US18720519
申请日：2022-12-16
Applicant: CommScope Technologies LLC
Inventor： Jozef Marie Roger BRANTS , Johan GEENS , Jiri ZAVREL , Karel A C VANWINKEL
Abstract: The present disclosure relates to an enclosure mounting apparatus (e.g., a mounting bracket which may include a mounting plate) having a molded plastic construction. In certain examples, the enclosure mounting apparatus is configured to be compatible with a number of different styles (e.g., sizes, models, etc.) of telecommunications enclosures.
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