-
公开(公告)号：US20240047844A1
公开(公告)日：2024-02-08
申请号：US18333655
申请日：2023-06-13
Applicant: CommScope Technologies LLC
Inventor： Kamalakar Yeddula , NBVS Krishna , Rakesh Kalwani , Kumara Swamy Kasani
CPC classification number: H01P5/16 , H01Q9/16 , H01P3/08 , H05K1/0237
Abstract: A hybrid coupler is disclosed. The hybrid coupler comprises a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer. The first metallization layer comprises at least two input ports and at least two output ports. The hybrid coupler further comprises a plurality of couplers coupled adjacent to each other on the first metallization layer. Each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer. The hybrid coupler furthermore comprises a defective ground structure having a pre-defined shape defined in the second metallization layer below each coupling junction formed between the transmission traces of the plurality of couplers.
-
公开(公告)号：US20240322415A1
公开(公告)日：2024-09-26
申请号：US18672519
申请日：2024-05-23
Applicant: CommScope Technologies LLC
Inventor： Kamalakar Yeddula , NBVS Krishna , Rakesh Kalwani , Kumara Swamy Kasani
CPC classification number: H01P5/16 , H01P3/08 , H01Q9/16 , H05K1/0237
Abstract: A hybrid coupler is disclosed. The hybrid coupler includes a printed circuit board. The printed circuit board includes at least two input ports, at least two output ports, and a plurality of couplers, each coupler of the plurality of couplers comprising first and second transmission traces and a coupling junction connecting the first and second transmission traces. The plurality of couplers are electrically coupled in series between the input ports and the output ports. The hybrid coupler further includes a defective ground structure below the coupling junction of at least one of the plurality of couplers.
-
公开(公告)号：US12027745B2
公开(公告)日：2024-07-02
申请号：US18333655
申请日：2023-06-13
Applicant: CommScope Technologies LLC
Inventor： Kamalakar Yeddula , NBVS Krishna , Rakesh Kalwani , Kumara Swamy Kasani
CPC classification number: H01P5/16 , H01P3/08 , H01Q9/16 , H05K1/0237
Abstract: A hybrid coupler is disclosed. The hybrid coupler comprises a printed circuit board having a first metallization layer and a second metallization layer arranged below the first metallization layer. The first metallization layer comprises at least two input ports and at least two output ports. The hybrid coupler further comprises a plurality of couplers coupled adjacent to each other on the first metallization layer. Each coupler of the plurality of couplers comprises transmission traces electrically coupled with the transmission traces of an adjacent coupler and the transmission traces of the plurality of couplers extend between the input ports and the output ports of the first metallization layer. The hybrid coupler furthermore comprises a defective ground structure having a pre-defined shape defined in the second metallization layer below each coupling junction formed between the transmission traces of the plurality of couplers.
-
-
Search Results
3
records
(took 0.011 seconds)
