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公开(公告)号:US20130334054A1
公开(公告)日:2013-12-19
申请号:US13916817
申请日:2013-06-13
IPC分类号: H01L21/48
CPC分类号: H01L21/4885 , C25D3/38 , C25D9/08
摘要: A method for forming, on a conductive or semiconductor substrate, nanowires based on CuSCN, including the steps of: preparing an aqueous electrolytic solution from a Cu(II) salt having a concentration lower than 120 mM, a Cu(II) complexing agent from the aminocarboxylic acid family, and a thiocyanate salt, the solution having a pH ranging between 0.1 and 3; electrochemically depositing the aqueous electrolytic solution on the substrate.
摘要翻译: 一种在导电或半导体衬底上形成基于CuSCN的纳米线的方法,包括以下步骤:从浓度低于120mM的Cu(II)盐制备电解质水溶液,制备Cu(II)络合剂, 氨基羧酸系和硫氰酸盐,该溶液的pH范围在0.1和3之间; 在基材上电化学沉积含水电解液。