公开(公告)号：US20180204105A1

公开(公告)日：2018-07-19

申请号：US15742813

申请日：2015-07-08

Applicant: CompoSecure, LLC

Inventor： JOHN HERSLOW ,  ADAM LOWE ,  LUIS DASILVA ,  BRIAN NESTER

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07722 ,  G06K19/0723 ,  G06K19/07769 ,  G06K19/07771 ,  G06K19/07773

Abstract: A dual interface smart card having a metal layer includes an SC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.

公开(公告)号：US20180307962A1

公开(公告)日：2018-10-25

申请号：US15976612

申请日：2018-05-10

Applicant: COMPOSECURE, LLC

Inventor： ADAM LOWE ,  JOHN HERSLOW ,  LUIS DASILVA ,  BRIAN NESTER

IPC: G06K19/077 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/38

CPC classification number: G06K19/07794 ,  H01L23/66 ,  H01L2223/6677 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/38

Abstract: A card having a metal layer and an opening or cut-out region in the metal layer, with a dual-interface integrated circuit (IC) module disposed in the opening or cut-out region. A ferrite layer is disposed below the metal layer and a booster antenna is attached to the ferrite layer. A vertical hole extends beneath the IC module through the ferrite layer. The booster antenna may be physically connected to the IC module or may be configured to inductively couple to the IC module. In some embodiments, the IC may be disposed in or on a non-conductive plug disposed within the opening or cut-out region, or the vertical hole may have a non-conductive lining, or a connector may be disposed between the booster antenna and the IC module in the vertical hole.