公开(公告)号：US20180204105A1

公开(公告)日：2018-07-19

申请号：US15742813

申请日：2015-07-08

申请人： CompoSecure, LLC

发明人： JOHN HERSLOW ,  ADAM LOWE ,  LUIS DASILVA ,  BRIAN NESTER

IPC分类号： G06K19/077 ,  G06K19/07

CPC分类号： G06K19/07722 ,  G06K19/0723 ,  G06K19/07769 ,  G06K19/07771 ,  G06K19/07773

摘要： A dual interface smart card having a metal layer includes an SC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.

公开(公告)号：US20180349751A1

公开(公告)日：2018-12-06

申请号：US15555248

申请日：2015-03-10

申请人： COMPOSECURE, LLC

发明人： JOHN HERSLOW ,  ADAM LOWE ,  LUIS DASILVA

IPC分类号： G06K19/077 ,  B29C59/02 ,  B32B3/08 ,  B32B38/00 ,  B32B3/30 ,  B32B7/12 ,  B32B15/09 ,  B32B15/082 ,  B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  B32B37/12 ,  B32B38/06 ,  B42D25/373 ,  B42D25/435 ,  B42D25/425 ,  B42D25/455 ,  B42D25/46 ,  B42D25/328

CPC分类号： G06K19/07722 ,  B29C59/026 ,  B29C2059/023 ,  B29C2791/009 ,  B29K2027/06 ,  B29K2067/003 ,  B29K2627/06 ,  B29K2667/003 ,  B29L2017/006 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B15/08 ,  B32B15/082 ,  B32B15/09 ,  B32B27/08 ,  B32B27/304 ,  B32B27/36 ,  B32B37/12 ,  B32B38/0008 ,  B32B38/06 ,  B32B38/14 ,  B32B38/145 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/30 ,  B32B2307/402 ,  B32B2307/416 ,  B32B2307/584 ,  B32B2307/702 ,  B32B2307/75 ,  B32B2309/02 ,  B32B2310/0843 ,  B32B2311/00 ,  B32B2327/06 ,  B32B2367/00 ,  B32B2398/20 ,  B32B2425/00 ,  B32B2519/02 ,  B42D25/328 ,  B42D25/373 ,  B42D25/41 ,  B42D25/425 ,  B42D25/435 ,  B42D25/455 ,  B42D25/46 ,  G06K19/06187 ,  G06K19/07773 ,  G06K19/07775

摘要： A multi layered card embodying the invention includes an outer layer of an amorphous laser reactive copolymer material which is embossed with a selected pattern at a selected temperature which is above the glass transition temperature, Tg, of the copolymer and below its melting temperature, Tm. So embossed, the selected pattern is set in the copolymer layer, and its external shape cannot be changed from the embossed form to which it was set at the selected temperature, without destroying the selected pattern. The outer layer may be laminated with the other layers of the card and laser engraved before or after lamination.

公开(公告)号：US20180307962A1

公开(公告)日：2018-10-25

申请号：US15976612

申请日：2018-05-10

申请人： COMPOSECURE, LLC

发明人： ADAM LOWE ,  JOHN HERSLOW ,  LUIS DASILVA ,  BRIAN NESTER

IPC分类号： G06K19/077 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/38

CPC分类号： G06K19/07794 ,  H01L23/66 ,  H01L2223/6677 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/38

摘要： A card having a metal layer and an opening or cut-out region in the metal layer, with a dual-interface integrated circuit (IC) module disposed in the opening or cut-out region. A ferrite layer is disposed below the metal layer and a booster antenna is attached to the ferrite layer. A vertical hole extends beneath the IC module through the ferrite layer. The booster antenna may be physically connected to the IC module or may be configured to inductively couple to the IC module. In some embodiments, the IC may be disposed in or on a non-conductive plug disposed within the opening or cut-out region, or the vertical hole may have a non-conductive lining, or a connector may be disposed between the booster antenna and the IC module in the vertical hole.