公开(公告)号：US12086669B2

公开(公告)日：2024-09-10

申请号：US17550130

申请日：2021-12-14

Applicant: CompoSecure, LLC

Inventor： Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  B32B3/30 ,  B32B9/00 ,  B32B15/04 ,  B32B37/18 ,  B32B38/00 ,  B42D25/22 ,  B42D25/328 ,  B42D25/346 ,  B42D25/351 ,  B42D25/373 ,  B42D25/455 ,  B42D25/46 ,  B42D25/475 ,  F21V8/00 ,  F21V23/06 ,  F21V33/00 ,  F21Y115/10 ,  G06Q20/34

CPC classification number: G06K19/07722 ,  B32B3/30 ,  B32B9/005 ,  B32B15/04 ,  B32B37/18 ,  B32B38/0004 ,  B32B38/145 ,  B42D25/22 ,  B42D25/328 ,  B42D25/346 ,  B42D25/351 ,  B42D25/373 ,  B42D25/455 ,  B42D25/46 ,  B42D25/475 ,  F21V23/06 ,  F21V33/0004 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2307/412 ,  B32B2310/0843 ,  B32B2425/00 ,  F21Y2115/10 ,  G02B6/0011 ,  G06Q20/352

Abstract: A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light guide light input.

公开(公告)号：US11853829B2

公开(公告)日：2023-12-26

申请号：US15861321

申请日：2018-01-03

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: B32B7/12 ,  B32B9/04 ,  B32B13/04 ,  B32B13/06 ,  B32B13/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/10 ,  B32B15/14 ,  B32B21/08 ,  B32B21/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/36 ,  B32B3/04 ,  B32B3/08 ,  C25D5/02 ,  C25D11/04 ,  C25D11/18 ,  G06K19/077 ,  C25D11/08 ,  C25D11/24 ,  C25D11/26 ,  C25D11/34 ,  G06K19/02 ,  B32B33/00 ,  B32B21/00 ,  B32B9/00 ,  B32B21/04 ,  B32B3/14 ,  B32B3/30 ,  B32B9/02 ,  B32B15/20 ,  B32B27/38 ,  B32B37/12 ,  B32B37/18 ,  B32B38/06 ,  B32B38/10 ,  B32B38/14 ,  B32B38/00 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D7/00 ,  B32B27/18

CPC classification number: G06K19/07722 ,  B32B3/04 ,  B32B3/08 ,  B32B3/14 ,  B32B3/30 ,  B32B7/12 ,  B32B9/00 ,  B32B9/005 ,  B32B9/02 ,  B32B9/025 ,  B32B9/04 ,  B32B9/041 ,  B32B9/042 ,  B32B9/045 ,  B32B9/047 ,  B32B13/04 ,  B32B13/06 ,  B32B13/12 ,  B32B15/04 ,  B32B15/043 ,  B32B15/08 ,  B32B15/10 ,  B32B15/14 ,  B32B15/20 ,  B32B21/00 ,  B32B21/04 ,  B32B21/08 ,  B32B21/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B37/12 ,  B32B37/18 ,  B32B38/06 ,  B32B38/10 ,  B32B38/14 ,  B32B38/145 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/022 ,  C25D7/00 ,  C25D11/04 ,  C25D11/08 ,  C25D11/243 ,  C25D11/26 ,  C25D11/34 ,  G06K19/02 ,  G06K19/022 ,  B32B27/18 ,  B32B38/0012 ,  B32B38/105 ,  B32B2038/0016 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2255/00 ,  B32B2255/06 ,  B32B2255/08 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2264/108 ,  B32B2307/40 ,  B32B2307/402 ,  B32B2307/584 ,  B32B2307/732 ,  B32B2311/24 ,  B32B2313/04 ,  B32B2315/02 ,  B32B2317/08 ,  B32B2317/16 ,  B32B2363/00 ,  B32B2425/00 ,  C25D11/246 ,  Y10T29/49004 ,  Y10T29/49828 ,  Y10T156/10 ,  Y10T156/1039 ,  Y10T156/1082

Abstract: Cards made in accordance with the invention include a decorative layer attached to a core layer, where the decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. At least one of the decorative layers is a layer derived from plant matter (e.g., wood). The cards may be dual interface smart cards that can be read in a contactless manner and/or via contacts.

公开(公告)号：US11301744B2

公开(公告)日：2022-04-12

申请号：US16935948

申请日：2020-07-22

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  H01L23/66 ,  H01Q1/38 ,  H01Q1/22

Abstract: A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.

公开(公告)号：US20200151535A1

公开(公告)日：2020-05-14

申请号：US16739211

申请日：2020-01-10

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.

公开(公告)号：US10534990B2

公开(公告)日：2020-01-14

申请号：US16367595

申请日：2019-03-28

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

Abstract: A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.

公开(公告)号：US20180197062A1

公开(公告)日：2018-07-12

申请号：US15861321

申请日：2018-01-03

Applicant: CompoSecure, LLC

Inventor： JOHN HERSLOW ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  G06K19/02 ,  B32B3/04 ,  C25D11/34 ,  C25D11/26 ,  C25D11/24 ,  C25D11/18 ,  C25D11/04 ,  C25D7/00 ,  C25D5/02 ,  C25D3/50 ,  C25D3/48 ,  C25D3/46 ,  B32B38/14 ,  B32B33/00 ,  B32B27/38 ,  B32B27/36 ,  B32B27/12 ,  B32B27/08 ,  B32B21/14 ,  B32B21/08 ,  B32B15/20 ,  B32B15/14 ,  B32B15/10 ,  B32B15/08 ,  B32B15/04 ,  B32B13/12 ,  B32B13/06 ,  B32B13/04 ,  B32B9/04 ,  B32B9/02 ,  B32B9/00 ,  B32B7/12 ,  B32B3/30 ,  B32B3/14 ,  B32B3/08 ,  B32B38/00 ,  B32B38/10 ,  B32B38/06 ,  B32B37/18 ,  B32B37/12 ,  B32B27/18

CPC classification number: G06K19/07722 ,  B32B3/04 ,  B32B3/08 ,  B32B3/14 ,  B32B3/30 ,  B32B7/12 ,  B32B9/00 ,  B32B9/005 ,  B32B9/02 ,  B32B9/025 ,  B32B9/04 ,  B32B9/041 ,  B32B9/042 ,  B32B9/045 ,  B32B9/047 ,  B32B13/04 ,  B32B13/06 ,  B32B13/12 ,  B32B15/04 ,  B32B15/043 ,  B32B15/08 ,  B32B15/10 ,  B32B15/14 ,  B32B15/20 ,  B32B21/00 ,  B32B21/04 ,  B32B21/08 ,  B32B21/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B37/12 ,  B32B37/18 ,  B32B38/0012 ,  B32B38/06 ,  B32B38/10 ,  B32B38/105 ,  B32B38/14 ,  B32B38/145 ,  B32B2038/0016 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2255/00 ,  B32B2255/06 ,  B32B2255/08 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2264/108 ,  B32B2307/40 ,  B32B2307/402 ,  B32B2307/584 ,  B32B2307/732 ,  B32B2311/24 ,  B32B2313/04 ,  B32B2315/02 ,  B32B2317/08 ,  B32B2317/16 ,  B32B2363/00 ,  B32B2425/00 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/022 ,  C25D7/00 ,  C25D11/04 ,  C25D11/18 ,  C25D11/243 ,  C25D11/246 ,  C25D11/26 ,  C25D11/34 ,  G06K19/02 ,  G06K19/022 ,  Y10T29/49004 ,  Y10T29/49828 ,  Y10T156/10 ,  Y10T156/1039 ,  Y10T156/1082

Abstract: Cards made in accordance with the invention include a decorative layer attached to a core layer, where the decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. At least one of the decorative layers is a layer derived from plant matter (e.g., wood). The cards may be dual interface smart cards that can be read in a contactless manner and/or via contacts.

公开(公告)号：US20180129927A1

公开(公告)日：2018-05-10

申请号：US15860286

申请日：2018-01-02

Applicant: CompoSecure, LLC

Inventor： JOHN HERSLOW ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  G06K19/02 ,  B32B3/04 ,  C25D11/34 ,  C25D11/26 ,  C25D11/24 ,  C25D11/18 ,  C25D11/04 ,  C25D7/00 ,  C25D5/02 ,  C25D3/50 ,  C25D3/48 ,  C25D3/46 ,  B32B38/14 ,  B32B33/00 ,  B32B27/38 ,  B32B27/36 ,  B32B27/12 ,  B32B27/08 ,  B32B21/14 ,  B32B21/08 ,  B32B15/20 ,  B32B15/14 ,  B32B15/10 ,  B32B15/08 ,  B32B15/04 ,  B32B13/12 ,  B32B13/06 ,  B32B13/04 ,  B32B9/04 ,  B32B9/02 ,  B32B9/00 ,  B32B7/12 ,  B32B3/30 ,  B32B3/14 ,  B32B3/08 ,  B32B38/00 ,  B32B38/10 ,  B32B38/06 ,  B32B37/18 ,  B32B37/12 ,  B32B27/18

CPC classification number: G06K19/07722 ,  B32B3/04 ,  B32B3/08 ,  B32B3/14 ,  B32B3/30 ,  B32B7/12 ,  B32B9/00 ,  B32B9/005 ,  B32B9/02 ,  B32B9/025 ,  B32B9/04 ,  B32B9/041 ,  B32B9/042 ,  B32B9/045 ,  B32B9/047 ,  B32B13/04 ,  B32B13/06 ,  B32B13/12 ,  B32B15/04 ,  B32B15/043 ,  B32B15/08 ,  B32B15/10 ,  B32B15/14 ,  B32B15/20 ,  B32B21/00 ,  B32B21/04 ,  B32B21/08 ,  B32B21/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B37/12 ,  B32B37/18 ,  B32B38/0012 ,  B32B38/06 ,  B32B38/10 ,  B32B38/105 ,  B32B38/14 ,  B32B38/145 ,  B32B2038/0016 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2255/00 ,  B32B2255/06 ,  B32B2255/08 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2264/108 ,  B32B2307/40 ,  B32B2307/402 ,  B32B2307/584 ,  B32B2307/732 ,  B32B2311/24 ,  B32B2313/04 ,  B32B2315/02 ,  B32B2317/08 ,  B32B2317/16 ,  B32B2363/00 ,  B32B2425/00 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/022 ,  C25D7/00 ,  C25D11/04 ,  C25D11/18 ,  C25D11/243 ,  C25D11/246 ,  C25D11/26 ,  C25D11/34 ,  G06K19/02 ,  G06K19/022 ,  Y10T29/49004 ,  Y10T29/49828 ,  Y10T156/10 ,  Y10T156/1039 ,  Y10T156/1082

Abstract: Cards made in accordance with the invention include a decorative layer attached to a core layer, where the decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. At least one of the decorative layers is a layer derived from animal matter (e.g. leather). The cards may be dual interface smart cards configured to be read in a contactless manner and/or via contacts.

公开(公告)号：US20220101080A1

公开(公告)日：2022-03-31

申请号：US17550130

申请日：2021-12-14

Applicant: CompoSecure, LLC

Inventor： Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  B42D25/22 ,  B42D25/328 ,  B42D25/346 ,  B42D25/351 ,  B42D25/373 ,  B42D25/455 ,  B42D25/46 ,  B42D25/475 ,  B32B3/30 ,  B32B9/00 ,  B32B15/04 ,  B32B37/18 ,  B32B38/00 ,  F21V23/06 ,  F21V33/00

Abstract: A transaction card includes at least one metal layer having one or more apertures therein. A light guide is disposed beneath the metal layer. The light guide has a light output and a light input. The light output is positioned to transmit light through at least the one or more apertures of the metal layer. At least one LED is positioned to transmit light into the light guide light input

公开(公告)号：US10452967B2

公开(公告)日：2019-10-22

申请号：US15555248

申请日：2015-03-10

Applicant: COMPOSECURE, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/06 ,  G06K19/077 ,  B32B7/12 ,  B32B3/30 ,  B32B27/30 ,  B32B27/36 ,  B32B27/08 ,  B32B37/12 ,  B32B38/00 ,  B32B38/06 ,  B29C59/02 ,  B32B15/08 ,  B32B3/08 ,  B42D25/41 ,  B42D25/425 ,  B42D25/455 ,  B42D25/46 ,  B42D25/435 ,  B42D25/373 ,  B42D25/328 ,  B32B15/082 ,  B32B15/09 ,  B32B38/14 ,  B29K667/00 ,  B29K627/06 ,  B29L17/00 ,  B29K27/06 ,  B29K67/00

Abstract: A multi layered card embodying the invention includes an outer layer of an amorphous laser reactive copolymer material which is embossed with a selected pattern at a selected temperature which is above the glass transition temperature, Tg, of the copolymer and below its melting temperature, Tm. So embossed, the selected pattern is set in the copolymer layer, and its external shape cannot be changed from the embossed form to which it was set at the selected temperature, without destroying the selected pattern. The outer layer may be laminated with the other layers of the card and laser engraved before or after lamination.

公开(公告)号：US10318859B2

公开(公告)日：2019-06-11

申请号：US15976612

申请日：2018-05-10

Applicant: COMPOSECURE, LLC

Inventor： Adam Lowe ,  John Herslow ,  Luis Dasilva ,  Brian Nester

IPC: H01Q1/22 ,  G06K19/077 ,  H01L23/66 ,  H01Q1/38

Abstract: A card having a metal layer and an opening or cut-out region in the metal layer, with a dual-interface integrated circuit (IC) module disposed in the opening or cut-out region. A ferrite layer is disposed below the metal layer and a booster antenna is attached to the ferrite layer. A vertical hole extends beneath the IC module through the ferrite layer. The booster antenna may be physically connected to the IC module or may be configured to inductively couple to the IC module. In some embodiments, the IC may be disposed in or on a non-conductive plug disposed within the opening or cut-out region, or the vertical hole may have a non-conductive lining, or a connector may be disposed between the booster antenna and the IC module in the vertical hole.