公开(公告)号：US20040134967A1

公开(公告)日：2004-07-15

申请号：US10704215

申请日：2003-11-06

Applicant: Conductis, Inc.

Inventor： Brian H. Moeckly ,  Kookrin Char

IPC: B23K001/00

CPC classification number: H01L39/2496

Abstract: A process is provided for fabricating YBa2Cu3O7 thin-film edge junctions in which no deposited barrier is employed. These devices display excellent RSJ-type I-V characteristics with values of Ic and Rn tunable over a useful range for operation of digital circuits.

Abstract translation: 提供了一种用于制造其中不使用沉积的屏障的YBa2Cu3O7薄膜边缘结的方法。 这些器件显示出良好的RSJ型I-V特性，Ic和Rn的值可在数字电路的有用范围内进行调节。