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公开(公告)号:US20210057691A1
公开(公告)日:2021-02-25
申请号:US16977508
申请日:2018-12-28
Applicant: Contemporary Amperex Technology Co., Limited
Inventor: Zhaolin XIE , Peng WANG , Derong WANG , Libing CHAN , Zengzhong WANG , Yifeng CHEN
Abstract: The application relates to a battery pack case and a battery pack. The battery pack case includes: a bottom plate and a side plate connected with the bottom plate, the bottom plate and the side plate surround to form an accommodating portion configured to accommodate a unit cell; the bottom plate is provided with a plurality of first grooves and a plurality of second grooves opening toward the accommodating portion, the plurality of first grooves are spaced apart from each other, the plurality of second grooves are spaced apart from each other, and the first grooves and the second grooves are arranged to cross each other. The bottom plate of the battery pack itself has good rigidity, is not prone to warp deformation, and can prevent the overflow of structural glue from contaminating the wiring harness or electrical components.
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公开(公告)号:US20230077414A1
公开(公告)日:2023-03-16
申请号:US17990849
申请日:2022-11-21
Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
Inventor: Zhaolin XIE , Peng WANG , Derong WANG , Libing CHAN , Zengzhong WANG , Yifeng CHEN
Abstract: The application relates to a battery pack case and a battery pack. The battery pack case includes: a bottom plate and a side plate connected with the bottom plate, the bottom plate and the side plate surround to form an accommodating portion configured to accommodate a unit cell; the bottom plate is provided with a plurality of first grooves and a plurality of second grooves opening toward the accommodating portion, the plurality of first grooves are spaced apart from each other, the plurality of second grooves are spaced apart from each other, and the first grooves and the second grooves are arranged to cross each other. The bottom plate of the battery pack itself has good rigidity, is not prone to warp deformation, and can prevent the overflow of structural glue from contaminating the wiring harness or electrical components.
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