公开(公告)号：US20140290052A1

公开(公告)日：2014-10-02

申请号：US14228964

申请日：2014-03-28

Applicant: Control Techniques Limited

Inventor： Dnyaneshwar Prabhakarrao Bujade ,  Sarang Sharad GHODKE ,  Dilesh Arvind Raut

IPC: H05K13/00

CPC classification number: H05K7/142 ,  Y10T29/49126 ,  Y10T29/5313

Abstract: An apparatus for connecting two or more circuit boards, the apparatus comprising: a first circuit board comprising a first surface and a second surface, the second surface having a first conductive pad; a second circuit board comprising a third surface and a fourth surface, the third surface having a second conductive pad; a fixing means configured to engage with the first circuit board and the second circuit board to couple the first circuit board to the second circuit board, wherein, when coupled, the fixing means is electrically isolated from one of the first circuit board and the second circuit board; and an electrically conductive spacer configured to electrically couple the first conductive pad and the second conductive pad.

Abstract translation: 一种用于连接两个或多个电路板的装置，所述装置包括：第一电路板，包括第一表面和第二表面，所述第二表面具有第一导电焊盘; 包括第三表面和第四表面的第二电路板，所述第三表面具有第二导电焊盘; 固定装置，被配置为与所述第一电路板和所述第二电路板接合以将所述第一电路板耦合到所述第二电路板，其中，当耦合时，所述固定装置与所述第一电路板和所述第二电路中的一个电隔离 板; 以及导电间隔件，其被配置为电耦合所述第一导电焊盘和所述第二导电焊盘。