Abstract:
A data communication system is disclosed including a cable medium and modulator adapted to carry data and power between a high speed data source and a high speed data sink. Relatively high speed data (e.g. the TMDS data of an HDMI interface) may be carried on optical waveguides in the cable medium. Relatively low-speed data (e.g., DDC data and clock, and CEC of an HDMI interface) may be carried on a separate set of optical waveguides or wire mediums. The optical waveguides allow for substantially less signal distortion of the high-speed data, thereby allowing the cable medium to achieve much higher lengths without significantly affecting the high-speed signaling.
Abstract:
A data communication system is disclosed including a cable medium and modulator adapted to carry data and power between a high speed data source and a high speed data sink. Relatively high speed data (e.g. the TMDS data of an HDMI interface) may be carried on optical waveguides in the cable medium. Relatively low-speed data (e.g., DDC data and clock, and CEC of an HDMI interface) may be carried on a separate set of optical waveguides or wire mediums. The optical waveguides allow for substantially less signal distortion of the high-speed data, thereby allowing the cable medium to achieve much higher lengths without significantly affecting the high-speed signaling.
Abstract:
An optical communication mount configured for surface mounting of optical transmitters, receivers or transceivers. The mount includes a housing having holes extending from the back side to the front side of the housing. The mount includes a first set of electrically-conductive traces disposed on a bottom side of the housing for surface mounting the mount on a printed circuit board (PCB), and a second set of electrically-conductive traces disposed on the front side of the housing. The mount also includes optical fibers extending into the thru-holes from the back side of the housing. The mount includes photo devices substantially registered with the thru-holes at the front side of the housing in a manner to receive and/or transmit more optical signals by way of the optical fibers, wherein the photo devices are configured to receive bias voltages from the PCB by way of the first and second sets of electrically-conductive traces.
Abstract:
A data communication system is disclosed including a cable medium and modulator adapted to carry data and power between a high speed data source and a high speed data sink. Relatively high speed data (e.g. the TMDS data of an HDMI interface) may be carried on optical waveguides in the cable medium. Relatively low-speed data (e.g., DDC data and clock, and CEC of an HDMI interface) may be carried on a separate set of optical waveguides or wire mediums. The optical waveguides allow for substantially less signal distortion of the high-speed data, thereby allowing the cable medium to achieve much higher lengths without significantly affecting the high-speed signaling.
Abstract:
A data communication system is disclosed including a cable medium and modulator adapted to carry data and power between a high speed data source and a high speed data sink. Relatively high speed data (e.g. the TMDS data of an HDMI interface) may be carried on optical waveguides in the cable medium. Relatively low-speed data (e.g., DDC data and clock, and CEC of an HDMI interface) may be carried on a separate set of optical waveguides or wire mediums. The optical waveguides allow for substantially less signal distortion of the high-speed data, thereby allowing the cable medium to achieve much higher lengths without significantly affecting the high-speed signaling.
Abstract:
An optical communication mount configured for surface mounting of optical transmitters, receivers or transceivers. The mount includes a housing having holes extending from the back side to the front side of the housing. The mount includes a first set of electrically-conductive traces disposed on a bottom side of the housing for surface mounting the mount on a printed circuit board (PCB), and a second set of electrically-conductive traces disposed on the front side of the housing. The mount also includes optical fibers extending into the thru-holes from the back side of the housing. The mount includes photo devices substantially registered with the thru-holes at the front side of the housing in a manner to receive and/or transmit more optical signals by way of the optical fibers, wherein the photo devices are configured to receive bias voltages from the PCB by way of the first and second sets of electrically-conductive traces.
Abstract:
A data communication system is disclosed including a cable medium and modulator adapted to carry data and power between a high speed data source and a high speed data sink. Relatively high speed data (e.g. the TMDS data of an HDMI interface) may be carried on optical waveguides in the cable medium. Relatively low-speed data (e.g., DDC data and clock, and CEC of an HDMI interface) may be carried on a separate set of optical waveguides or wire mediums. The optical waveguides allow for substantially less signal distortion of the high-speed data, thereby allowing the cable medium to achieve much higher lengths without significantly affecting the high-speed signaling.
Abstract:
Various implementations of a data communication cable assembly are disclosed that improve the transmission of data signals that traverse long distances. Some cable assembly implementations are configured to transmit data signals via one or more electrical wire mediums and one or more signal extenders that modify the data signals for improved transmission between devices over one or more electrical wire mediums. Other cable assembly implementations are configured to transmit data signals via one or more optical transmission mediums and optical-to-electrical and electrical-to-optical converters for improved transmission of the data signals between devices. Other cable assembly implementations are configured for cascading or daisy-chaining together for transmitting data signals between devices in the optical and/or electrical domain.
Abstract:
An optical communication mount configured for surface mounting of optical transmitters, receivers or transceivers. The mount includes a housing having holes extending from the back side to the front side of the housing. The mount includes a first set of electrically-conductive traces disposed on a bottom side of the housing for surface mounting the mount on a printed circuit board (PCB), and a second set of electrically-conductive traces disposed on the front side of the housing. The mount also includes optical fibers extending into the thru-holes from the back side of the housing. The mount includes photo devices substantially registered with the thru-holes at the front side of the housing in a manner to receive and/or transmit more optical signals by way of the optical fibers, wherein the photo devices are configured to receive bias voltages from the PCB by way of the first and second sets of electrically-conductive traces.
Abstract:
A communications cable is disclosed. The cable includes a first circuit configured to receive electrical data signals from a data source via an input connector, and convert the electrical data signals into optical signals for transmission by way of one or more optical fibers. The cable includes a second circuit configured to convert the optical signals received via the one or more optical fibers back to electrical data signals for providing to a data sink via an output connector. The cable includes a third circuit for applying pre- and post-signal conditioning to bi-directional control data for transmission to and received from the data sink via wires. The cable includes a fourth circuit for applying pre- and post-signal conditioning to bi-directional control data for transmission to and received from the data source via wires. The pre- and post-signal conditioning compensate for capacitance and/or resistance effects on the signals introduced by the wires.