公开(公告)号：US20130005084A1

公开(公告)日：2013-01-03

申请号：US13435548

申请日：2012-03-30

Applicant: Craig Dumas ,  Vijaykumar Sundermurthy

Inventor： Craig Dumas ,  Vijaykumar Sundermurthy

IPC: H01L21/60

CPC classification number: H05K1/144 ,  H01L25/162 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K1/145 ,  H05K3/107 ,  H05K2201/042 ,  H01L2924/00

Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.

Abstract translation: 这里描述的是一种电子设备，其中一个或多个平面互连结构插入在两个基板之间，每个基板上都包含混合电路。 平面互连结构具有形成在其一个面上的多个导电迹线，用于电连接每个混合电路的互连点集合。

公开(公告)号：US08148201B2

公开(公告)日：2012-04-03

申请号：US12563752

申请日：2009-09-21

Applicant: Craig Dumas ,  Vijaykumar Sundermurthy

Inventor： Craig Dumas ,  Vijaykumar Sundermurthy

IPC: H01L21/00

CPC classification number: H05K1/144 ,  H01L25/162 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K1/145 ,  H05K3/107 ,  H05K2201/042 ,  H01L2924/00

Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.

Abstract translation: 这里描述的是一种电子设备，其中一个或多个平面互连结构插入在两个基板之间，每个基板上都包含混合电路。 平面互连结构具有形成在其一个面上的多个导电迹线，用于电连接每个混合电路的互连点集合。

公开(公告)号：US20080272496A1

公开(公告)日：2008-11-06

申请号：US11743644

申请日：2007-05-02

Applicant: Craig Dumas ,  Vijaykumar Sundermurthy

Inventor： Craig Dumas ,  Vijaykumar Sundermurthy

IPC: H01L23/48 ,  H01L21/4763

CPC classification number: H05K1/144 ,  H01L25/162 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K1/145 ,  H05K3/107 ,  H05K2201/042 ,  H01L2924/00

Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.

Abstract translation: 这里描述的是一种电子设备，其中一个或多个平面互连结构插入在两个基板之间，每个基板上都包含混合电路。 平面互连结构具有形成在其一个面上的多个导电迹线，用于电连接每个混合电路的互连点集合。

公开(公告)号：US08546186B2

公开(公告)日：2013-10-01

申请号：US13435548

申请日：2012-03-30

Applicant: Craig Dumas ,  Vijaykumar Sundermurthy

Inventor： Craig Dumas ,  Vijaykumar Sundermurthy

IPC: H01L21/00

CPC classification number: H05K1/144 ,  H01L25/162 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K1/145 ,  H05K3/107 ,  H05K2201/042 ,  H01L2924/00

Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.

Abstract translation: 这里描述的是一种电子设备，其中一个或多个平面互连结构插入在两个基板之间，每个基板上都包含混合电路。 平面互连结构具有形成在其一个面上的多个导电迹线，用于电连接每个混合电路的互连点集合。

公开(公告)号：US20100009498A1

公开(公告)日：2010-01-14

申请号：US12563752

申请日：2009-09-21

Applicant: Craig Dumas ,  Vijaykumar Sundermurthy

Inventor： Craig Dumas ,  Vijaykumar Sundermurthy

IPC: H01L25/16

CPC classification number: H05K1/144 ,  H01L25/162 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K1/145 ,  H05K3/107 ,  H05K2201/042 ,  H01L2924/00

Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.

Abstract translation: 这里描述的是一种电子设备，其中一个或多个平面互连结构插入在两个基板之间，每个基板上都包含混合电路。 平面互连结构具有形成在其一个面上的多个导电迹线，用于电连接每个混合电路的互连点集合。