公开(公告)号：US09664369B2

公开(公告)日：2017-05-30

申请号：US14207847

申请日：2014-03-13

Applicant: Cree, Inc.

Inventor： Charles Richards ,  Shawn Keeney ,  Mark Youmans ,  Michael Leung ,  Nicholas Desilva ,  Dante Nava ,  Robert Higley

IPC: F21K99/00 ,  F21V29/00 ,  F21V29/70 ,  F21K9/232 ,  F21V3/00 ,  F21Y115/10 ,  F21Y107/00

CPC classification number: F21V29/70 ,  F21K9/232 ,  F21V3/00 ,  F21V29/004 ,  F21V29/506 ,  F21V29/83 ,  F21Y2107/00 ,  F21Y2115/10

Abstract: A LED lamp has a base and an at least partially optically transmissive enclosure connected to the base. A heat sink is partially disposed in the enclosure and supports a plurality of LEDs. The heat sink comprising a mounting portion positioned in the enclosure for supporting the LEDs and a heat dissipating portion exposed to the ambient environment where the interior of the enclosure is exposed to the ambient environment. The heat sink have a plurality of separate heat sink structures that are mounted to the lamp independently of one another. Each heat sink structure may have a thickness of approximately 1-5 mm. Each heat sink structure may in some embodiments weigh approximately 3.8 to 7.7 grams and in other embodiments weigh approximately 27 grams.

公开(公告)号：US20140268772A1

公开(公告)日：2014-09-18

申请号：US14207847

申请日：2014-03-13

Applicant: Cree, Inc.

Inventor： Charles Richards ,  Shawn Keeney ,  Mark Youmans ,  Michael Leung ,  Nicholas Desilva ,  Dante Nava ,  Robert Higley

IPC: F21K99/00 ,  F21V29/00

CPC classification number: F21V29/70 ,  F21K9/232 ,  F21V3/00 ,  F21V29/004 ,  F21V29/506 ,  F21V29/83 ,  F21Y2107/00 ,  F21Y2115/10

Abstract: A LED lamp has a base and an at least partially optically transmissive enclosure connected to the base. A heat sink is partially disposed in the enclosure and supports a plurality of LEDs. The heat sink comprising a mounting portion positioned in the enclosure for supporting the LEDs and a heat dissipating portion exposed to the ambient environment where the interior of the enclosure is exposed to the ambient environment. The heat sink have a plurality of separate heat sink structures that are mounted to the lamp independently of one another. Each heat sink structure may have a thickness of approximately 1-5 mm. Each heat sink structure may in some embodiments weigh approximately 3.8 to 7.7 grams and in other embodiments weigh approximately 27 grams.

Abstract translation: LED灯具有连接到基座的基部和至少部分光学透射的外壳。 散热器部分地设置在外壳中并支撑多个LED。 散热器包括位于外壳中用于支撑LED的安装部分和暴露于外壳内部暴露于周围环境的周围环境的散热部分。 散热器具有多个分开的散热结构，其彼此独立地安装在灯上。 每个散热器结构可以具有大约1-5mm的厚度。 在一些实施例中，每个散热器结构可以重约3.8至7.7克，在其他实施例中重约27克。