公开(公告)号：US20040228097A1

公开(公告)日：2004-11-18

申请号：US10437183

申请日：2003-05-14

Applicant: Cyntec Co., Ltd.

Inventor： Da-Jung Chen ,  Chin-Hsiung Liao

IPC: H05K007/20

CPC classification number: H01L23/3735 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to save the required area of substrate and production cost.

Abstract translation: 一种高密度功率模块封装，其中电路和功率模块的芯片的一部分形成在各个基板上，使得电路图案不受芯片的影响。 因此，可以提高电路的密度，以节省基板所需的面积和生产成本。