公开(公告)号：US20230099270A1

公开(公告)日：2023-03-30

申请号：US17798722

申请日：2021-02-10

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Atsushi NAGAI ,  Toshiki KATOKU ,  Tetsuya OJIRI ,  Takayuki KOMAI

IPC: H01M50/126

Abstract: Provided is an exterior material for an electrical storage device that can be cold molded, the exterior material being configured from a layered body comprising at least a base material layer, an adhesive agent layer, a barrier layer, and a thermally fusible resin layer in the stated order, wherein the exterior material for an electrical storage device has exceptional moist heat resistance. An exterior material for an electrical storage device, the exterior material being configured from a layered body comprising at least a base material layer, an adhesive agent layer, a barrier layer, and a thermally fusible resin layer in the stated order, the adhesive agent layer having moist heat resistance, and it being possible to conduct cold molding on the layered body.

公开(公告)号：US20250125456A1

公开(公告)日：2025-04-17

申请号：US18683853

申请日：2022-08-10

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Toshiki KATOKU ,  Atsushi NAGAI ,  Takayuki KOMAI

IPC: H01M50/126 ,  H01M50/105 ,  H01M50/119 ,  H01M50/121 ,  H01M50/131

Abstract: An outer package material for power storage devices, the outer package material being configured from a multilayer body that sequentially comprises at least a base material layer, an adhesive layer, a barrier layer and a thermally fusible resin layer in this order, wherein: the base material layer comprises a polyamide layer; the polyamide layer has a thermal shrinkage ratio of 2.5% or less at 180° C. in the machine direction; and the adhesive layer has a glass transition temperature (Tg) of 100° C. to 139° C.