公开(公告)号：US20230344041A1

公开(公告)日：2023-10-26

申请号：US18035122

申请日：2021-11-24

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Makoto AMANO ,  Daisuke YASUDA ,  Masahiro TATSUZAWA ,  Kazuhiko YOKOTA ,  Takanori YAMASHITA ,  Yasuaki MUTOU ,  Jun KAGEYAMA ,  Hironori KAMIJO

IPC: H01M50/129 ,  H01M10/04

CPC classification number: H01M50/129 ,  H01M10/0481

Abstract: A power storage device packaging material includes a laminate having at least a base material layer, a barrier layer, and a heat-sealable resin layer sequentially from an outer side, wherein the base material layer includes a polyester film and a polyamide film, the polyester film has a thickness of 10 μm or more and 14 μm or less, and the polyamide film has a thickness of 18 μm or more and 22 μm or less.