公开(公告)号：US20030173000A1

公开(公告)日：2003-09-18

申请号：US10367753

申请日：2003-02-19

Applicant: DAIDO METAL COMPANY, LTD.

Inventor： Kenji Sakai ,  Hiroyuki Sugawara ,  Hideo Ishikawa ,  Masaaki Sakamoto

IPC: C22C009/02

CPC classification number: F16C33/121 ,  C22C9/02 ,  C22C9/06 ,  F16C17/02 ,  F16C33/14 ,  F16C2204/12

Abstract: Disclosed is a sliding material containing 0.5 to 15 mass % of Sn, 0.2 to 10 mass % of Ni, 0.4 to 10 volume % of hard particles, and the balance being essentially Cu. The hard particles are of one or more selected from the group consisting of WC, W2C, Mo2C, W, and Mo. A grain size of the CunullSnnullNi matrix is set to be not more than 0.070 mm.

Abstract translation: 公开了含有Sn：0.5〜15质量％，Ni：0.2〜10质量％，硬质粒子数为0.4〜10体积％，余量基本为Cu的滑动材料。 硬质粒子选自WC，W2C，Mo2C，W，Mo中的一种以上。将Cu-Sn-Ni基体的粒径设定为0.070mm以下。