公开(公告)号：US20030173000A1

公开(公告)日：2003-09-18

申请号：US10367753

申请日：2003-02-19

Applicant: DAIDO METAL COMPANY, LTD.

Inventor： Kenji Sakai ,  Hiroyuki Sugawara ,  Hideo Ishikawa ,  Masaaki Sakamoto

IPC: C22C009/02

CPC classification number: F16C33/121 ,  C22C9/02 ,  C22C9/06 ,  F16C17/02 ,  F16C33/14 ,  F16C2204/12

Abstract: Disclosed is a sliding material containing 0.5 to 15 mass % of Sn, 0.2 to 10 mass % of Ni, 0.4 to 10 volume % of hard particles, and the balance being essentially Cu. The hard particles are of one or more selected from the group consisting of WC, W2C, Mo2C, W, and Mo. A grain size of the CunullSnnullNi matrix is set to be not more than 0.070 mm.

Abstract translation: 公开了含有Sn：0.5〜15质量％，Ni：0.2〜10质量％，硬质粒子数为0.4〜10体积％，余量基本为Cu的滑动材料。 硬质粒子选自WC，W2C，Mo2C，W，Mo中的一种以上。将Cu-Sn-Ni基体的粒径设定为0.070mm以下。

公开(公告)号：US20030102059A1

公开(公告)日：2003-06-05

申请号：US10264776

申请日：2002-10-04

Applicant: Daido Metal Company Ltd.

Inventor： Yukihiko Kagohara ,  Takeshi Hoshina ,  Hideo Ishikawa ,  Masaaki Sakamoto

IPC: C22C021/02

CPC classification number: C22C21/003 ,  B32B15/012 ,  F16C33/121 ,  F16C2204/20

Abstract: An aluminum bearing-alloy containing 1.5 to 8 mass % of Si is provided, in which there can be observed Si grains on the sliding surface of the aluminum bearing-alloy. A fractional area of the observed Si grains having a grain size of less than 4 nullm is 20 to 60% of a total area of all the observed Si grains. Another fractional area of the observed Si grains having a grain size of from 4 to 20 nullm is not less than 40% of the total area of all the observed Si grains.

Abstract translation: 提供含有1.5〜8质量％的Si的铝轴承合金，其中可以在铝轴承合金的滑动表面上观察到Si颗粒。 观察到的粒径小于4μm的Si晶粒的分数为所有观察到的Si晶粒的总面积的20〜60％。 观察到的具有4〜20μm的粒度的Si粒子的另一个分数面积不小于所有观察到的Si晶粒的总面积的40％。

公开(公告)号：US20040247932A1

公开(公告)日：2004-12-09

申请号：US10857923

申请日：2004-06-02

Applicant: Daido Metal Company Ltd.

Inventor： Yukihiko Kagohara ,  Takeshi Hoshina ,  Hideo Ishikawa ,  Masaaki Sakamoto

IPC: C25D005/10

CPC classification number: B32B15/012 ,  F16C33/127 ,  Y10S384/912 ,  Y10S428/925 ,  Y10T428/12493 ,  Y10T428/12736 ,  Y10T428/12757 ,  Y10T428/12764

Abstract: A multilayer aluminum-base alloy bearing formed by bonding a bearing alloy layer made of an aluminum-base alloy to a steel back metal through an intermediate layer made of an aluminum-base alloy, the intermediate layer being composed of two layers, that is, a lower layer and an upper layer, the lower layer in contact with the steel back metal being lower in hardness than the upper layer. Since the lower layer is soft, it is excellent in bonding property for the back metal, and since the upper layer is hard, it withstands a load exerted on the bearing alloy layer.

Abstract translation: 通过由铝基合金制成的中间层将由铝基合金构成的轴承合金层与钢背金属接合形成的多层铝基合金轴承，所述中间层由两层组成， 下层和上层，与钢背金属接触的下层的硬度低于上层。 由于下层较软，所以背面金属的接合性优异，并且由于上层较硬，所以能承受施加在轴承合金层上的载荷。

公开(公告)号：US20040028939A1

公开(公告)日：2004-02-12

申请号：US10638494

申请日：2003-08-12

Applicant: Daido Metal Company Ltd.

Inventor： Yukihiko Kagohara ,  Takeshi Hoshina ,  Hideo Ishikawa ,  Masaaki Sakamoto

IPC: B32B015/10

CPC classification number: B32B15/012 ,  C21D9/40 ,  C22F1/04 ,  F16C33/12 ,  F16C2204/20 ,  Y10S384/912 ,  Y10T428/12736 ,  Y10T428/12757 ,  Y10T428/12764

Abstract: Disclosed is a multi-layered Al-base bearing consisting of a steel back layer, an intermediate Al alloy layer and an Al-base bearing alloy layer which contains one or more elements selected from the group of Cu, Zn, Mg and Si, and which is bonded to the steel back layer via the intermediate Al alloy layer. The bearing is subjected to solution treatment at a temperature of not lower than 400null C. The intermediate Al alloy layer has a sub-layer being in direct contact with the steel back layer, and at least one sub-layer positioned closer than the former sub-layer to the Al-base bearing alloy layer. The former sub-layer consists of an Al alloy contains 2 to 8 mass % Si, and has a thickness proportion of 5 to 25% to the entire thickness of the intermediate Al alloy layer.

Abstract translation: 公开了一种多层Al基轴承，其由钢背层，中间Al合金层和含有选自Cu，Zn，Mg和Si中的一种或多种元素的Al基承载合金层组成，以及 其通过中间Al合金层与钢背层接合。 轴承在不低于400℃的温度下进行固溶处理。中间Al合金层具有与钢背层直接接触的子层，并且至少一个位于比前者更靠近的子层 分层到Al基轴承合金层。 前一层由含有2〜8质量％Si的Al合金构成，并且与中间Al合金层的整体厚度成比例为5〜25％。

公开(公告)号：US20030048961A1

公开(公告)日：2003-03-13

申请号：US10238535

申请日：2002-09-10

Applicant: Daido Metal Company Ltd.

Inventor： Toshiaki Kawachi ,  Hideo Ishikawa ,  Masaaki Sakamoto

IPC: F16C033/02

CPC classification number: C22C12/00 ,  B32B15/01 ,  B32B15/012 ,  B32B15/013 ,  B32B15/017 ,  B32B15/018 ,  C22C9/04 ,  C23C28/021 ,  C23C28/023 ,  C25D5/18 ,  C25D7/10 ,  F16C9/00 ,  F16C33/121 ,  Y10S384/912

Abstract: There is provided a sliding member comprising a bearing alloy layer and an overlay layer bonded to the bearing alloy layer which overlay layer is made of Bi having a crystal grain density of 50 to 300 pieces/100 nullm2. The overlay layer may be made of a Bi-base alloy containing Cu or Ag. The sliding member further comprises a conforming layer provided on the overlay layer in a case where the overlay layer is made of the Bi-based alloy.

Abstract translation: 提供了一种滑动构件，其包括结合到轴承合金层的轴承合金层和覆盖层，该覆盖层由晶体密度为50至300个/ 100mum 2的Bi制成。 覆盖层可以由含有Cu或Ag的Bi基合金制成。 在覆盖层由Bi基合金制成的情况下，滑动构件还包括设置在覆盖层上的适形层。

公开(公告)号：US20040241489A1

公开(公告)日：2004-12-02

申请号：US10854261

申请日：2004-05-27

Applicant: Daido Metal Company Ltd.

Inventor： Toshiaki Kawachi ,  Hideo Ishikawa ,  Masaaki Sakamoto

IPC: B32B015/01

CPC classification number: C22C12/00 ,  B32B15/012 ,  B32B15/015 ,  C23C28/021 ,  C25D3/56 ,  C25D5/10 ,  C25D5/18 ,  C25D7/10 ,  F16C33/121 ,  F16C2204/36 ,  Y10S384/912 ,  Y10T428/12681

Abstract: Disclosed is a sliding member including an overlay layer made of a Bi based alloy comprising Cu as an essential element and at least one element selected from the group of Sn and In, wherein the Bi based alloy comprises 0.1 to 10 mass % of Cu and 0.5 to 10 mass % in total of the at least one element selected from the group of Sn and In.

Abstract translation: 公开了一种滑动构件，其包括由包含Cu作为必需元素的Bi基合金和从Sn和In组中选择的至少一种元素制成的覆层，其中所述Bi基合金包含0.1至10质量％的Cu和0.5 至少一种选自Sn和In的元素的总量为10质量％。

公开(公告)号：US20030180572A1

公开(公告)日：2003-09-25

申请号：US10379731

申请日：2003-03-06

Applicant: Daido Metal Company Ltd.

Inventor： Akinori Norito ,  Toshiaki Kawachi ,  Hideo Ishikawa ,  Takayuki Shibayama ,  Kunihiko Iwasaki ,  Cristian Petrica Lungu

IPC: B32B015/04

CPC classification number: C23C28/046 ,  C23C14/06 ,  C23C14/357 ,  C23C28/048 ,  C23C30/00 ,  F16C33/10 ,  F16C33/12 ,  Y10S384/907 ,  Y10S384/912 ,  Y10S384/913 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/12625 ,  Y10T428/12896

Abstract: In a slide member comprising a base member and a slide layer including a first surface fixed to the base member and a second surface being opposite to the first surface in a thickness direction of the slide layer and capable of contacting another member in such a manner that the another member is movable on the second surface, the slide layer includes silver as a main component of the slide layer and a solid lubricant.

Abstract translation: 在包括基部构件和滑动层的滑动构件中，滑动层包括固定到基座构件的第一表面和在滑动层的厚度方向上与第一表面相对的第二表面，并且能够以这样的方式接触另一构件： 另一个构件可在第二表面上移动，滑动层包括作为滑动层的主要成分的银和固体润滑剂。

公开(公告)号：US20030118862A1

公开(公告)日：2003-06-26

申请号：US10263816

申请日：2002-10-04

Applicant: Daido Metal Company Ltd.

Inventor： Toshiaki Kawachi ,  Hideo Ishikawa ,  Masaaki Sakamoto

IPC: B32B015/16

CPC classification number: C23C28/021 ,  B32B15/013 ,  C22C9/02 ,  C22C11/00 ,  C22C11/04 ,  C22C11/06 ,  C22C32/0068 ,  C22C2204/00 ,  C23C28/027 ,  C23C28/028 ,  C25D7/10 ,  F16C33/121 ,  Y10S384/912 ,  Y10T428/12535 ,  Y10T428/12701

Abstract: Disclosed is a sliding member having a bearing alloy layer and a composite plating film provided on the bearing alloy layer. The composite plating film is made of a lead alloy containing 0.1 to 10 mass percent in total of copper and 0.3 to 25 volume percent in total of co-deposited inorganic particles. The outermost surface layer of the composite plating film, which has a thickness proportion of 10 to 40% to the entire thickness of the composite plating film, does not contain inorganic particles and copper. The lower layer of the composite plating film contains Cu and inorganic particles, such as Si3N4, dispersed therein.

Abstract translation: 公开了一种具有轴承合金层和设置在轴承合金层上的复合镀膜的滑动构件。 复合镀膜由含有0.1〜10质量％的铜和0.3〜25体积％的共沉积无机粒子的铅合金构成。 与复合镀膜的整个厚度相比，厚度比例为10〜40％的复合镀膜的最外表面层不含有无机粒子和铜。 复合镀膜的下层含有Cu和分散在其中的Si 3 N 4等无机粒子。