公开(公告)号：US20230395966A1

公开(公告)日：2023-12-07

申请号：US18250078

申请日：2021-12-13

Applicant: DAIO PAPER CORPORATION

Inventor： Takuro Shimada ,  Alina Kan

IPC: H01Q1/22 ,  H01Q9/16 ,  H01Q7/00 ,  G06K19/077

CPC classification number: H01Q1/2225 ,  H01Q9/16 ,  H01Q7/00 ,  G06K19/07786

Abstract: An RFID tag including an inlay that is thin and easy to manufacture. The above problem is solved by an RFID tag including an inlay in which an IC chip and an antenna are provided on a base material having a main surface, wherein the antenna includes a loop conductive portion having both end portions connected to the IC chip so as to form a loop shape through the IC chip, and a dipole antenna portion disposed to surround the loop conductive portion with an interval allowing inductive coupling, and the loop conductive portion and the dipole antenna portion are formed on the main surface to have same thickness based on the main surface, and the IC chip is disposed on both end portions of the loop conductive portion.