公开(公告)号：US20230395966A1

公开(公告)日：2023-12-07

申请号：US18250078

申请日：2021-12-13

Applicant: DAIO PAPER CORPORATION

Inventor： Takuro Shimada ,  Alina Kan

IPC: H01Q1/22 ,  H01Q9/16 ,  H01Q7/00 ,  G06K19/077

CPC classification number: H01Q1/2225 ,  H01Q9/16 ,  H01Q7/00 ,  G06K19/07786

Abstract: An RFID tag including an inlay that is thin and easy to manufacture. The above problem is solved by an RFID tag including an inlay in which an IC chip and an antenna are provided on a base material having a main surface, wherein the antenna includes a loop conductive portion having both end portions connected to the IC chip so as to form a loop shape through the IC chip, and a dipole antenna portion disposed to surround the loop conductive portion with an interval allowing inductive coupling, and the loop conductive portion and the dipole antenna portion are formed on the main surface to have same thickness based on the main surface, and the IC chip is disposed on both end portions of the loop conductive portion.

公开(公告)号：USD980201S1

公开(公告)日：2023-03-07

申请号：US35514448

申请日：2021-12-17

Applicant: DAIO PAPER CORPORATION

Designer： Takuro Shimada ,  Alina Bista ,  Curt Carrender

公开(公告)号：USD979543S1

公开(公告)日：2023-02-28

申请号：US35513106

申请日：2021-06-04

Applicant: DAIO PAPER CORPORATION

Designer： Takuro Shimada ,  Alina Bista ,  Curt Carrender

公开(公告)号：US12039394B2

公开(公告)日：2024-07-16

申请号：US17596856

申请日：2020-07-16

Applicant: DAIO PAPER CORPORATION

Inventor： Takuro Shimada ,  Daiji Matsunoshita

IPC: G06K19/077 ,  B65D23/00 ,  H01Q1/22 ,  H01Q5/371 ,  H01Q7/00 ,  H01Q9/26

CPC classification number: G06K19/07775 ,  B65D23/00 ,  G06K19/07786 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q5/371 ,  H01Q7/00 ,  H01Q9/26

Abstract: A RFID tag for placement on a surface of a container that contains a liquid is provided. The RFID tag includes an IC chip configured to store identification information, a loop conductor connected to the IC chip, and an antenna unit that includes two conductor units connected to the loop conductor and extending away from each other from the loop conductor.

公开(公告)号：USD980200S1

公开(公告)日：2023-03-07

申请号：US35513108

申请日：2021-06-04

Applicant: DAIO PAPER CORPORATION

Designer： Takuro Shimada ,  Alina Bista ,  Curt Carrender

公开(公告)号：USD956730S1

公开(公告)日：2022-07-05

申请号：US35513087

申请日：2021-06-04

Applicant: DAIO PAPER CORPORATION

Designer： Takuro Shimada ,  Alina Bista

公开(公告)号：USD912020S1

公开(公告)日：2021-03-02

申请号：US29709788

申请日：2019-10-17

Applicant: DAIO PAPER CORPORATION ,  DAIO ENGINEERING Co., ltd.

Designer： Takuro Shimada ,  Bista Alina ,  Carrender Curt

公开(公告)号：USD912019S1

公开(公告)日：2021-03-02

申请号：US29709787

申请日：2019-10-17

Applicant: DAIO PAPER CORPORATION ,  DAIO ENGINEERING Co., ltd.

Designer： Takuro Shimada ,  Bista Alina ,  Carrender Curt

公开(公告)号：USD962210S1

公开(公告)日：2022-08-30

申请号：US35513043

申请日：2021-05-27

Applicant: DAIO PAPER CORPORATION

Designer： Takuro Shimada ,  Alina Bista

公开(公告)号：USD921618S1

公开(公告)日：2021-06-08

申请号：US29716091

申请日：2019-12-06

Applicant: DAIO PAPER CORPORATION ,  DAIO ENGINEERING Co., ltd.

Designer： Takuro Shimada ,  Bista Alina