公开(公告)号：US20150083474A1

公开(公告)日：2015-03-26

申请号：US14394766

申请日：2013-04-15

Applicant: DAISO CO., LTD.

Inventor： Kensuke Kawamura ,  Hideaki Umakoshi

IPC: C09D11/52 ,  H05K1/09

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  H05K1/097

Abstract: An electroconductive ink composition comprising silver particles (A), a compound having a siloxane backbone with a functional group (B), and an organic solvent (C), the silver particles (A) having a protective layer containing an amino group-containing compound and having a mean particle size of 1 nm or more and 100 nm or less, the content of the compound (B) being 4% by weight to 8% by weight based on the total amount of the composition, can form a circuit pattern on a polymer film with low heat resistance, and the obtained circuit pattern has excellent adhesion to a substrate and high conductivity.

Abstract translation: 一种包含银颗粒（A），具有官能团（B）的硅氧烷主链的化合物和有机溶剂（C））的导电油墨组合物，具有含有含氨基化合物的保护层的银颗粒 平均粒径为1nm以上且100nm以下，化合物（B）的含量相对于组合物的总量为4重量％〜8重量％，可以形成电路图案 具有低耐热性的聚合物膜，并且所获得的电路图案对基材具有优异的粘附性和高导电性。

公开(公告)号：US09481804B2

公开(公告)日：2016-11-01

申请号：US14394766

申请日：2013-04-15

Applicant: DAISO CO., LTD.

Inventor： Kensuke Kawamura ,  Hideaki Umakoshi

IPC: C09D11/52 ,  H05K1/09 ,  C09D11/033 ,  C09D11/037

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  H05K1/097

Abstract: An electroconductive ink composition comprising silver particles (A), a compound having a siloxane backbone with a functional group (B), and an organic solvent (C), the silver particles (A) having a protective layer containing an amino group-containing compound and having a mean particle size of 1 nm or more and 100 nm or less, the content of the compound (B) being 4% by weight to 8% by weight based on the total amount of the composition, can form a circuit pattern on a polymer film with low heat resistance, and the obtained circuit pattern has excellent adhesion to a substrate and high conductivity.

Abstract translation: 一种包含银颗粒（A），具有官能团（B）的硅氧烷主链的化合物和有机溶剂（C））的导电油墨组合物，具有含有含氨基化合物的保护层的银颗粒 平均粒径为1nm以上且100nm以下，化合物（B）的含量相对于组合物的总量为4重量％〜8重量％，可以形成电路图案 具有低耐热性的聚合物膜，并且所获得的电路图案对基材具有优异的粘附性和高导电性。