公开(公告)号：US20070182559A1

公开(公告)日：2007-08-09

申请号：US11532214

申请日：2006-09-15

申请人： DANIEL LAWRENCE ,  KEVIN ASHTON ,  DANIEL GAMOTA ,  MICHAEL FEIN ,  JOHAN SIDEN

发明人： DANIEL LAWRENCE ,  KEVIN ASHTON ,  DANIEL GAMOTA ,  MICHAEL FEIN ,  JOHAN SIDEN

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  G08B13/2417 ,  G08B13/2445 ,  G08B13/2474

摘要： An RFID antenna is fabricated to operate in three dimensions. An antenna including a first conductive trace and at least one second conductive trace is formed on an unfolded packaging substrate having a first surface and at least one second surface. An integrated circuit is connected across the conductive traces. The unfolded packaging substrate is formed into a three-dimensional package having multiple sides. For example, the unfolded packaging substrate is folded into a cube-shaped container having six sides. The integrated circuit is formed on a first side, while portions of the first and second conductive traces may be formed on both the first side and at least one second side. In this manner, the antenna is three-dimensional and operable to more effectively communicate with a three-dimensional electromagnetic field.

摘要翻译： RFID天线被制造成三维操作。 包括第一导电迹线和至少一个第二导电迹线的天线形成在具有第一表面和至少一个第二表面的未折叠封装衬底上。 集成电路连接在导电迹线上。 未折叠的包装衬底被形成为具有多个侧面的三维封装。 例如，展开后的包装衬底被折叠成具有六个侧面的立方体状容器。 集成电路形成在第一侧上，而第一和第二导电迹线的一部分可以形成在第一侧和至少一个第二侧上。 以这种方式，天线是三维的并且可操作以更有效地与三维电磁场通信。