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公开(公告)号:US20200295104A1
公开(公告)日:2020-09-17
申请号:US16818155
申请日:2020-03-13
申请人: DB HITEK CO., LTD.
发明人: Young Jin Kim , Dae Il Kim , Dong Hoon Park
IPC分类号: H01L27/32
摘要: An anode structure includes an insulating interlayer pattern disposed on a substrate, the insulation interlayer pattern including a lower metal pattern for each of cell regions and via contacts extending in a vertical direction and being connected to the lower metal patterns therein, respectively, cell isolation pillars disposed on the insulation interlayer pattern, each of the cell isolation pillars extending in the vertical direction to electrically isolate the plurality of cells regions from one another, a reflective layer pattern disposed on the insulating interlayer pattern and between the cell isolation pillars, and an anode pattern disposed on the reflective layer pattern, the anode pattern being electrically connected to each of the via contacts through the reflective layer pattern.
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公开(公告)号:US20190319081A1
公开(公告)日:2019-10-17
申请号:US16385485
申请日:2019-04-16
申请人: DB HITEK CO., LTD.
发明人: Dae Il Kim , Seung Ha Lee , Jung Hyun Lee , Jin Hyo Jung , Young Jin Kim , Dong Hoon Park
摘要: A signal control unit for an organic light emitting diode (OLED) display device, includes a substrate structure including a plurality of active elements each corresponding to a pixel, a lower metal pattern disposed on the substrate structure, and electrically connected to a portion of the plurality of active elements, an insulating interlayer disposed on the substrate structure and at least partially covering the lower metal pattern, a via contact penetrating through the insulating interlayer and connected to the lower metal pattern, a metal electrode disposed on the insulating interlayer, and connected to the via contact, and an electrode passivation layer pattern substantially covering the metal electrode to expose a center portion of an upper surface of the metal electrode while covering a remainder of the upper surface and a side surface of the metal electrode. Therefore, leakage current which flows through the side surface of the metal electrode is suppressed.
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公开(公告)号:US11189674B2
公开(公告)日:2021-11-30
申请号:US16818155
申请日:2020-03-13
申请人: DB HITEK CO., LTD.
发明人: Young Jin Kim , Dae Il Kim , Dong Hoon Park
摘要: An anode structure includes an insulating interlayer pattern disposed on a substrate, the insulation interlayer pattern including a lower metal pattern for each of cell regions and via contacts extending in a vertical direction and being connected to the lower metal patterns therein, respectively, cell isolation pillars disposed on the insulation interlayer pattern, each of the cell isolation pillars extending in the vertical direction to electrically isolate the plurality of cells regions from one another, a reflective layer pattern disposed on the insulating interlayer pattern and between the cell isolation pillars, and an anode pattern disposed on the reflective layer pattern, the anode pattern being electrically connected to each of the via contacts through the reflective layer pattern.
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公开(公告)号:US10950675B2
公开(公告)日:2021-03-16
申请号:US16385485
申请日:2019-04-16
申请人: DB HITEK CO., LTD.
发明人: Dae Il Kim , Seung Ha Lee , Jung Hyun Lee , Jin Hyo Jung , Young Jin Kim , Dong Hoon Park
摘要: A signal control unit for an organic light emitting diode (OLED) display device, includes a substrate structure including a plurality of active elements each corresponding to a pixel, a lower metal pattern disposed on the substrate structure, and electrically connected to a portion of the plurality of active elements, an insulating interlayer disposed on the substrate structure and at least partially covering the lower metal pattern, a via contact penetrating through the insulating interlayer and connected to the lower metal pattern, a metal electrode disposed on the insulating interlayer, and connected to the via contact, and an electrode passivation layer pattern substantially covering the metal electrode to expose a center portion of an upper surface of the metal electrode while covering a remainder of the upper surface and a side surface of the metal electrode. Therefore, leakage current which flows through the side surface of the metal electrode is suppressed.
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