公开(公告)号：US10405425B2

公开(公告)日：2019-09-03

申请号：US15626244

申请日：2017-06-19

Applicant: DELL PRODUCTS, L.P.

Inventor： Vijendera Kumar ,  Bhyrav M. Mutnury ,  V. Mallikarjun Goud

IPC: H01R13/6596 ,  H05K1/11 ,  H01R12/72 ,  H05K1/02

Abstract: An Information handling system (IHS) includes a circuit board assembly with surface mount technology (SMT) pad structure. Landing pad(s) attached to circuit board substrate have a mounting area that receive an SMT connector pin onto adjacent pair of differential contact strips plated to nonconductive surface and extending longitudinally in parallel alignment. A return current strip is longitudinally aligned, adjacent to the differential contact strips on a first lateral side. The return current strip is connected to a ground plane of the circuit board substrate. Converging narrowing of the adjacent differential contact strip increases separation from a distal end of the return current strip. The separation improves signal integrity by reducing fringe effects, increasing impedance, and quenching resonance. A surface mount device (SMD) has one or more connector pins that are attached to the one or more landing pads to conduct the high-speed communication signal.