公开(公告)号：US20240250901A1

公开(公告)日：2024-07-25

申请号：US18157668

申请日：2023-01-20

Applicant: DELL PRODUCTS L.P.

Inventor： Senthil Kumar GANESAN ,  Venkatesan MAHALINGAM ,  Vinoth Kumar ARUMUGAM

IPC: H04L45/00 ,  H04L45/24 ,  H04L45/28

CPC classification number: H04L45/32 ,  H04L45/245 ,  H04L45/28

Abstract: Current data center deployments, particularly layer 2 (L2) deployments that use multi-chassis link aggregation group (MC-LAG) implementations, have limitations. Such deployments use a link, known as an inter-node link (INL)/inter-chassis link (ICL), to connect peer information handling system nodes. Because the peer nodes are coupled together via one or more INL connections, there are fewer ports available for each peer node to connect to end nodes. This configuration creates limitations to bandwidth and scaling, and also increase costs. Embodiments herein allow for the elimination of INLs by moving forwarding decisions to the spine node level. In one or more embodiments, a spine node determines ports to reach dual-homed, single-homed, and orphaned node that are connected to leaf node(s) based on information learned from the leaf nodes. For a leaf node, a sub-LAG (link aggregation group) may be created to reach single-homed/orphaned nodes connected to the leaf node.