公开(公告)号：US20170094836A1

公开(公告)日：2017-03-30

申请号：US15228008

申请日：2016-08-04

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Brian Lo ,  Mark A. Ebenhart

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20272 ,  H01L23/473 ,  H05K7/20927

Abstract: A fluid-cooled electronics assembly for high-power electronics includes an arrangement of electronic components that defines an upper-side of the arrangement and a lower-side of the arrangement opposite the upper-side. An upper-chamber is thermally coupled to the upper-side, and a lower-chamber thermally coupled to the lower-side. The upper-chamber and the lower-chamber are further configured to direct flowing-coolant series-wise from the lower-chamber into the upper-chamber. The upper-chamber and the lower-chamber are further configured to cooperatively define a manifold-connection operable to couple the assembly to a manifold-outlet and a manifold-inlet of a coolant-manifold. The assembly also includes a fitting configured to define an inlet-port of the assembly that directs the flowing-coolant from the manifold-outlet to the lower-inlet, and an outlet-port that directs the flowing-coolant from the upper-outlet to the manifold-inlet. The inlet-port and the outlet-port are characterized as adjacent and side-by-side ports that are segregated from each other by a wall-section.