公开(公告)号：US09131630B2

公开(公告)日：2015-09-08

申请号：US13917921

申请日：2013-06-14

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Scott D. Brandenburg ,  Richard D. Parker ,  Khalid M. Eltom

IPC: H05K7/20

CPC classification number: H05K7/20927

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract translation: 液体冷却的电力电子组件被配置为使用导电冷却剂来冷却功率电子器件，所述电子器件使用围绕电介质板的周边的金属套管密封的电介质板，以形成器件组件。 该配置允许电子设备和冷却剂之间的更直接接触，同时保护电子设备免受潜在导电的冷却剂的接触。 用于形成电介质板和壳体的材料被选择为具有相似的热膨胀系数（CTE），使得密封件的可靠性最大化。