公开(公告)号：US20240138113A1

公开(公告)日：2024-04-25

申请号：US18167078

申请日：2023-02-10

Applicant: DELTA ELECTRONICS, INC.

Inventor： Ren-Chun CHANG ,  Shao-Hsuan LAI ,  Siang-Lin YOU

IPC: H05K7/20

CPC classification number: H05K7/20318 ,  H05K7/20136 ,  H05K7/203 ,  H05K7/20309 ,  H05K7/20327 ,  H05K7/20818

Abstract: The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is arranged in a first cooling room and configured to blow a hot air inside a rack into a first cooling room. The evaporator is arranged in the first cooling room. The first condenser is arranged in a second cooling room. The second fan is arranged in the second cooling room and configured to blow an outside air into the second cooling room. The water-cooling device includes a radiator. The radiator is arranged in the second cooling room and configured to receive a hot liquid from an electronic device in the rack through a third pipeline and transmit a cold liquid to the electronic device through a fourth pipeline.

公开(公告)号：US20240237287A9

公开(公告)日：2024-07-11

申请号：US18167078

申请日：2023-02-10

Applicant: DELTA ELECTRONICS, INC.

Inventor： Ren-Chun CHANG ,  Shao-Hsuan LAI ,  Siang-Lin YOU

IPC: H05K7/20

CPC classification number: H05K7/20318 ,  H05K7/20136 ,  H05K7/203 ,  H05K7/20309 ,  H05K7/20327 ,  H05K7/20818

Abstract: The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is arranged in a first cooling room and configured to blow a hot air inside a rack into a first cooling room. The evaporator is arranged in the first cooling room. The first condenser is arranged in a second cooling room. The second fan is arranged in the second cooling room and configured to blow an outside air into the second cooling room. The water-cooling device includes a radiator. The radiator is arranged in the second cooling room and configured to receive a hot liquid from an electronic device in the rack through a third pipeline and transmit a cold liquid to the electronic device through a fourth pipeline.