公开(公告)号：US20190291217A1

公开(公告)日：2019-09-26

申请号：US16106007

申请日：2018-08-21

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shu-Han WU ,  Hung-Wen CHEN ,  Qi-Ming HUANG ,  Yang-Hao CHOU ,  Yun-Chung SUN

IPC: B23K31/12

Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.