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公开(公告)号：US20200082278A1
公开(公告)日：2020-03-12
申请号：US16355867
申请日：2019-03-18
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shu-Han WU , Hung-Wen CHEN , Ren-Feng DING , Yi-Jiun SHEN , Yu-Cheng SU
Abstract: A soldering process method includes steps of: establishing a material component database; establishing a working parameter database; analyzing material and component characteristics required for a new soldering process; comparing the characteristics with information in the material component database; selecting operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; performing the soldering process using the operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; measuring and recording the soldering process execution information and the final product information; determining whether the final product of the solder process meets the quality control requirements; using the machine learning method to fit the soldering process execution information and the final product information of the solder process to get the operating parameters for the next soldering process when the final product does not meet the quality control requirements.
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公开(公告)号：US20190174661A1
公开(公告)日：2019-06-06
申请号：US16000197
申请日：2018-06-05
Applicant: Delta Electronics, Inc.
Inventor： Yu-Ru HUANG , Hung-Wen CHEN
Abstract: An electronic-component assembly system is provided in the invention. The electronic-component assembly system includes a gripping device, a light-source device, a photographing device, and an image-processing device. The gripping device grips an electronic component, wherein the electronic component includes at least one pin. The light-source device includes a light source and emits light of the light source. The photographing device senses the light and generates a plurality of first one-dimensional images corresponding to the pins at different rotation angles. The image-processing device is coupled to the photographing device to receive the plurality of first one-dimensional images. The image-processing device transforms the plurality of first one-dimensional images into a two-dimensional image, generates adjustment information according to the two-dimensional image, and provides adjustment information to the gripping device, wherein the gripping device adjusts the angle and position of the electronic component according to the adjustment information.
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Patent Agency Ranking
公开(公告)号：US20220009029A1
公开(公告)日：2022-01-13
申请号：US17028088
申请日：2020-09-22
Applicant: Delta Electronics, Inc.
Inventor： Ren-Feng DING , Hung-Wen CHEN , Shu-Han WU
Abstract: A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.
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公开(公告)号：US20200337189A1
公开(公告)日：2020-10-22
申请号：US16539471
申请日：2019-08-13
Applicant: Delta Electronics, Inc.
Inventor： Yu-Ru HUANG , Qi-Ming HUANG , Hung-Wen CHEN
Abstract: A system for detecting electronic components includes a light-source device, a photography device, an adjustment device, and an image-processing device. The light-source device generates a light to illuminate at least one pin of a first electronic component at different rotation angles. The photography device senses the light and generates first and second images corresponding to the pin of the first electronic component at different rotation angles. The adjustment device adjusts the photography device and the light-source device to a first height and a second height, wherein the first images correspond to the first height and the second images correspond to the second height. The image-processing device calculates first feature information of the pin of the first electronic component according the first and second images, and analyzes the state of the pin of the first electronic component according to the first feature information.
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公开(公告)号：US20190291217A1
公开(公告)日：2019-09-26
申请号：US16106007
申请日：2018-08-21
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shu-Han WU , Hung-Wen CHEN , Qi-Ming HUANG , Yang-Hao CHOU , Yun-Chung SUN
IPC: B23K31/12
Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.
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公开(公告)号：US20220082787A1
公开(公告)日：2022-03-17
申请号：US17182653
申请日：2021-02-23
Applicant: Delta Electronics, Inc.
Inventor： Hung-Wen CHEN , Ren-Feng DING , Shih-Yung CHIU , Shu-Han WU , Keng-Ning CHANG
Abstract: A laser processing device for processing a workpiece is provided, including a laser emitter, a lens module, a driving module, a camera module, and a processing unit. The lens module has a first lens and a second lens, wherein the laser emitter emits a laser beam through the first and second lenses to the workpiece. The driving module drives the first lens to move relative to the second lens. The camera module captures an image of the workpiece. The processing unit is electrically connected to the camera module and the driving module, wherein the camera module transmits an image signal to the processing unit according to the image of the workpiece, and the processing unit transmits a driving signal to the driving module according to the image signal, driving the first lens to move relative to the second lens. A method for processing a workpiece is also provided.
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公开(公告)号：US20200055132A1
公开(公告)日：2020-02-20
申请号：US16216154
申请日：2018-12-11
Applicant: DELTA ELECTRONICS, INC.
Inventor： Ren-Feng DING , Hung-Wen CHEN , Shu-Han WU
Abstract: A multi-beam soldering system includes a multi-beam scanner, a sensor, and a controller. The multi-beam scanner generates at least a first beam and a second beam, and guides the first beam to a first element of a soldering zone and guides the second beam to a second element of the soldering zone. The sensor detects a first temperature of the first element and a second temperature of the second element simultaneously during soldering process. The controller adjusts the parameters of the first beam and the second beam under the condition that the first temperature is substantially different from the second temperature.
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