公开(公告)号：US20230411260A1

公开(公告)日：2023-12-21

申请号：US18181618

申请日：2023-03-10

Applicant: DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  MIRISE Technologies Corporation

Inventor： Kazuki KUWATA ,  Hiroshi ISHINO ,  Hirokazu SAMPEI ,  Masaru NARIKAWA

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/29 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L23/49838 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3114

Abstract: In a semiconductor module, first and second connection terminals and a control terminal are electrically connected to a semiconductor chip. The second connection terminal extends in a first direction in a resin molded part and projects from a predetermined surface of the resin molded part. An internal terminal of the first connection terminal extends in the resin molded part along the first direction and overlaps with the second connection terminal with a predetermined space therebetween in a second direction, and is exposed from an opening portion of the resin molded part. An external terminal of the first connection terminal is connected to the internal terminal at the opening portion and projects outside the resin molded part. The first connection terminal includes a tie bar remaining portion extending from the internal terminal in a direction that intersects the first direction and the second direction.

公开(公告)号：US20220068772A1

公开(公告)日：2022-03-03

申请号：US17392446

申请日：2021-08-03

Applicant: DENSO CORPORATION

Inventor： Hiroshi ISHINO ,  Hirokazu SAMPEI

IPC: H01L23/495 ,  H01L23/00

Abstract: In a semiconductor device, a first lead frame and a second lead frame are fixed to a metal conductor base by an organic insulating film made of a polyimide-based material. The organic insulating film satisfies relationships of tpress1>tcast1 and tpress2>tcast1, where tpress1 is a thickness of a portion of the organic insulating film sandwiched between the metal conductor base and the first lead frame, tpress2 is a thickness of a portion of the organic insulating film sandwiched between the metal conductor base and the second lead frame, and tcast1 is a thickness of a portion of the organic insulating film that is not sandwiched between the metal conductor base and the first lead frame and is not sandwiched between the metal conductor base and the second lead frame.