公开(公告)号：US20230309259A1

公开(公告)日：2023-09-28

申请号：US18311725

申请日：2023-05-03

Applicant: DENSO CORPORATION

Inventor： Naoki OOARATA ,  Hajime YOKOYAMA ,  Yousuke YAMAMOTO

IPC: H05K7/20

CPC classification number: H05K7/20209 ,  H05K7/20145 ,  H05K7/20863

Abstract: A measurement device unit includes: a data processing device; a protection cover covering at least an upper side of the data processing device and defining a space between the protection cover and the data processing device; a front side supply/discharge device provided on a front side of the vehicle, and supplying or discharging air between an outside of the protection cover and the space; a rear side supply/discharge device provided on a rear side of the vehicle, and supplying or discharging the air between the outside of the protection cover and the space; and a supply/discharge control device acquiring at least one item of information on an internal temperature of the protection cover, an external temperature of the protection cover, a traveling direction of the vehicle, presence or absence of a failure in the supply/discharge devices, and controlling air supply and discharge operations, based on the information acquired.

公开(公告)号：US20230037050A1

公开(公告)日：2023-02-02

申请号：US17938605

申请日：2022-10-06

Applicant: DENSO CORPORATION

Inventor： Naoki OOARATA ,  Hajime YOKOYAMA ,  Yousuke YAMAMOTO

IPC: H05K7/14 ,  H05K1/18 ,  H05K5/03

Abstract: A measuring device unit, mountable to an exterior of a vehicle, includes: a data processing device including a circuit board and a plurality of electronic components disposed thereon, and acquiring detection data, to generate integrated data; a container accommodating the data processing device; and a protective cover covering the container. The electronic components are classified in accordance with their respective heat generation amounts and respective heat resistance performances, and include a first electronic component classified as having a heat generation amount greater than a heat generation reference value and a heat resistance performance greater than a heat resistance reference value. The container includes a plurality of accommodation spaces in which the electronic components are accommodated in accordance with their respective classifications. The accommodation spaces include a first accommodation space designed for suppressing heat transfer to other accommodation spaces, and the first electronic component is accommodated in the first accommodation space.