公开(公告)号：US20170213778A1

公开(公告)日：2017-07-27

申请号：US15514555

申请日：2015-10-16

Applicant: DENSO CORPORATION

Inventor： Takeo YAMAMOTO ,  Kazuhiko SUGIURA

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L23/3735 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes: a heat spreader; a semiconductor element on the heat spreader; and a connection member arranged between the heat spreader and the semiconductor element. The heat spreader is arranged in an order of the first heat spreader, the second heat spreader and the first heat spreader in one direction of a plane of the heat spreader. Each of the first and second heat spreaders includes multiple anisotropic heat conductive planes having a high heat conductivity. The anisotropic heat conductive plane of the first heat spreader is in parallel to both a stacking direction and a first direction perpendicular to the stacking direction. The anisotropic heat conductive plane of the second heat spreader is in parallel to both the stacking direction and a second direction perpendicular to the stacking direction. A projection region of the semiconductor element overlaps with the second heat spreader.