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公开(公告)号:US11733063B2
公开(公告)日:2023-08-22
申请号:US16697902
申请日:2019-11-27
Applicant: DENSO CORPORATION
Inventor: Atsushi Kobayashi , Yasuhiro Kitaura , Michihiro Makita , Akito Sasaki , Tetsuya Ohmi
Abstract: A position sensor includes a detector and a signal processor. The detector includes: a sensor chip having a surface; a first detection element disposed at the surface of the sensor chip; and a second detection element disposed at the surface of the sensor chip. The signal processor processes a signal input from the detector. The first detection element outputs a first detection signal corresponding to a position of a detection target, based on a change in a magnetic field received from the detection target. The second detection element outputs a second detection signal corresponding to the position of the detection target, based on the change in the magnetic field received from the detection target. A center of balance of the first detection element coincides with a center of balance of the second detection element.
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公开(公告)号:US11041739B2
公开(公告)日:2021-06-22
申请号:US16420837
申请日:2019-05-23
Applicant: DENSO CORPORATION
Inventor: Tetsuya Ohmi , Michihiro Makita
Abstract: The rotation sensor includes a plurality of magnetic sensors for outputting a sine wave signal and a cosine wave signal corresponding to an electrical angle of rotation of the rotating body, and the magnetic sensors are arranged at equal intervals and in a circumferential direction of the rotating body apart from the outer periphery of the rotating body, and are fixed in position so as to detect a change in magnetic field caused by the change in the rotational position of the rotating body due to the rotation of the rotating body. The rotation sensor includes an arithmetic unit, which receives sine wave signals and cosine wave signals from a plurality of magnetic sensors, and adds and subtracts sine wave signals and cosine wave signals according to a predetermined rule, thereby cancels out the high-order components contained in sine wave signals and cosine wave signals.
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公开(公告)号:US11626338B2
公开(公告)日:2023-04-11
申请号:US17836406
申请日:2022-06-09
Applicant: DENSO CORPORATION
Inventor: Tetsuya Ohmi
IPC: G01R33/09 , H01L23/31 , H01L23/495
Abstract: A sensor device includes: a first sensor element; a second sensor element; and a processing chip that includes a semiconductor substrate, a first processor that receives a first detection signal and processes the first detection signal, a second processor that receives the second detection signal and processes the second detection signal, and an isolation portion that electrically isolates the first processor the second processor. The first processor includes a first diagnosis unit that self-diagnoses a presence or absence of a failure. The second processor includes a second diagnosis unit that self-diagnoses a presence or absence of a failure. The processing chip identifiably outputs a first output of the first processor and a second output of the second processor.
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公开(公告)号:US11493528B2
公开(公告)日:2022-11-08
申请号:US16677975
申请日:2019-11-08
Applicant: DENSO CORPORATION
Inventor: Akito Sasaki , Atsushi Kobayashi , Michihiro Makita , Tetsuya Ohmi
Abstract: A position sensor including: a power supply terminal to which a power supply voltage is applied; a ground terminal to which a ground voltage is applied; an output terminal that outputs a signal; a detection portion that operates based on the power supply voltage and the ground voltage, and detects a position of a detection target by a magnetic resistance element whose resistance value changes according to a movement of the detection target; and a signal processing portion that operates based on the power supply voltage and the ground voltage, and processes a signal input from the detection portion.
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公开(公告)号:US11652013B2
公开(公告)日:2023-05-16
申请号:US17836119
申请日:2022-06-09
Applicant: DENSO CORPORATION
Inventor: Tetsuya Ohmi
IPC: G01R33/09 , H01L23/31 , H01L23/495
CPC classification number: H01L23/3107 , G01R33/09 , H01L23/49517
Abstract: A sensor device includes: a first sensor element; a second sensor element; and a processing chip that includes a semiconductor substrate, a first processor that receives a first detection signal and processes the first detection signal, a second processor that receives the second detection signal and processes the second detection signal, and an isolation portion that electrically isolates the first processor the second processor. The first processor includes a first diagnosis unit that self-diagnoses a presence or absence of a failure. The second processor includes a second diagnosis unit that self-diagnoses a presence or absence of a failure. The processing chip identifiably outputs a first output of the first processor and a second output of the second processor.
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公开(公告)号:US11099034B2
公开(公告)日:2021-08-24
申请号:US16697806
申请日:2019-11-27
Applicant: DENSO CORPORATION
Inventor: Yasuhiro Kitaura , Atsushi Kobayashi , Michihiro Makita , Akito Sasaki , Tetsuya Ohmi
Abstract: A position sensor includes a detector and a signal processor. The detector includes a magnet generating a bias magnetic field and a detection element configured to be applied by the bias magnetic field, and generates plural detection signals including distinct phase difference and corresponding to plural ranges aligned in one direction along a movement direction of a detection target, based on a change in a magnetic field received by the detection element from the detection target with a movement of the detection target having a magnetic body. The signal processor acquires the detection signals from the detector, compares the detection signals with a threshold value, and specifies a position of the detection target as a position at one of the ranges based on a combination of magnitude relation between the detection signals and the threshold value.
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公开(公告)号:US20220301962A1
公开(公告)日:2022-09-22
申请号:US17836431
申请日:2022-06-09
Applicant: DENSO CORPORATION
Inventor: Tetsuya Ohmi
IPC: H01L23/31 , G01R33/09 , H01L23/495
Abstract: A sensor device includes: a first sensor element; a second sensor element; and a processing chip that includes a semiconductor substrate, a first processor that receives a first detection signal and processes the first detection signal, a second processor that receives the second detection signal and processes the second detection signal, and an isolation portion that electrically isolates the first processor the second processor. The first processor includes a first diagnosis unit that self-diagnoses a presence or absence of a failure. The second processor includes a second diagnosis unit that self-diagnoses a presence or absence of a failure. The processing chip identifiably outputs a first output of the first processor and a second output of the second processor.
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公开(公告)号:US11373917B2
公开(公告)日:2022-06-28
申请号:US16910160
申请日:2020-06-24
Applicant: DENSO CORPORATION
Inventor: Tetsuya Ohmi
IPC: G01R31/28 , H01L23/31 , G01R33/09 , H01L23/495
Abstract: A sensor device includes: a first sensor element; a second sensor element; and a processing chip that includes a semiconductor substrate, a first processor that receives a first detection signal and processes the first detection signal, a second processor that receives the second detection signal and processes the second detection signal, and an isolation portion that electrically isolates the first processor the second processor. The first processor includes a first diagnosis unit that self-diagnoses a presence or absence of a failure. The second processor includes a second diagnosis unit that self-diagnoses a presence or absence of a failure. The processing chip identifiably outputs a first output of the first processor and a second output of the second processor.
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公开(公告)号:US12174044B2
公开(公告)日:2024-12-24
申请号:US18147246
申请日:2022-12-28
Applicant: DENSO CORPORATION
Inventor: Yuki Matsumoto , Tsukasa Kono , Atsushi Kobayashi , Tetsuya Ohmi , Michihiro Makita , Naoki Watanabe , Sukhwa Jung
Abstract: Magnets are arranged at intervals along a stroke direction with an interposed space. Magnetic pole surfaces of adjacent ones of the magnets have opposite poles. A detector is arranged with a gap in a gap direction against a magnetic pole surface of each of the magnets and acquires a sine signal and a cosine signal as detection signals of phases corresponding to the positions of the magnets, based on a change in a magnetic field received from the magnets according to movement of the detector relative to the detection object in the stroke direction. A signal processor acquires the sine signal and the cosine signal from the detector, generates, based on the sine signal and the cosine signal, an arctangent signal corresponding to a stroke amount of the detection object relative to the detector, and acquires the arctangent signal as a position signal.
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公开(公告)号:US11615995B2
公开(公告)日:2023-03-28
申请号:US17836431
申请日:2022-06-09
Applicant: DENSO CORPORATION
Inventor: Tetsuya Ohmi
IPC: G01R33/09 , H01L23/31 , H01L23/495
Abstract: A sensor device includes: a first sensor element; a second sensor element; and a processing chip that includes a semiconductor substrate, a first processor that receives a first detection signal and processes the first detection signal, a second processor that receives the second detection signal and processes the second detection signal, and an isolation portion that electrically isolates the first processor the second processor. The first processor includes a first diagnosis unit that self-diagnoses a presence or absence of a failure. The second processor includes a second diagnosis unit that self-diagnoses a presence or absence of a failure. The processing chip identifiably outputs a first output of the first processor and a second output of the second processor.
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