公开(公告)号：US20200211954A1

公开(公告)日：2020-07-02

申请号：US16814260

申请日：2020-03-10

Applicant: DENSO CORPORATION

Inventor： Tomoo IWADE ,  Daisuke FUKUOKA

IPC: H01L23/50 ,  H01L23/52 ,  H01L23/495 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H02M7/00

Abstract: A semiconductor module includes a plurality of semiconductor elements, a sealing resin body, a positive electrode side terminal, a negative electrode side terminal, and an output terminal. The positive electrode side terminal, the negative electrode side terminal, and the output terminal are each connected to any of the semiconductor elements, and project from a same surface of the sealing resin body. Projecting portions of the positive electrode side terminal, the negative electrode side terminal, and the output terminal are arranged next to each other in an arrangement direction so that the projecting portion of the output terminal is located at an end.