DISPLAY DEVICE
    1.
    发明申请
    DISPLAY DEVICE 有权
    显示设备

    公开(公告)号:US20150356931A1

    公开(公告)日:2015-12-10

    申请号:US14763348

    申请日:2014-01-16

    Abstract: A display device includes a display, which has a display surface, and a touch panel, which is spaced from and is opposed to the display surface. An opening of a panel frame portion-relative to the touch panel is formed to be larger than an opening of a front case relative to the display unit. An insulator portion extends toward a center of the opening of the front case beyond an inner peripheral part of the front case to mask the front case from eyesight of a user.

    Abstract translation: 显示装置包括具有显示表面的显示器和与显示表面间隔开并与显示表面相对的触摸面板。 相对于触摸面板的面板框架部分的开口形成为大于前壳体相对于显示单元的开口。 绝缘体部分朝着前壳体的开口的中心延伸超过前壳体的内周部分,以从使用者的视力遮蔽前壳体。

    ELECTRONIC DEVICE FOR VEHICLE
    2.
    发明申请
    ELECTRONIC DEVICE FOR VEHICLE 有权
    车用电子装置

    公开(公告)号:US20150382502A1

    公开(公告)日:2015-12-31

    申请号:US14763844

    申请日:2013-11-08

    CPC classification number: H05K7/20136 H05K5/0004 H05K7/20863 H05K7/20972

    Abstract: An electronic device for a vehicle includes: a digital substrate having a first semiconductor package with a CPU, a second semiconductor package with a volatile memory readable and writable from the CPU, a third semiconductor package with a flash memory storing a start-up program of the CPU, and a fourth semiconductor package with a power supply management integrated circuit; and a fan that takes in air along the surface of the digital substrate on which the first to fourth semiconductor packages are mounted. The third semiconductor package is disposed to distance from the first semiconductor package by at least a first predetermined distance and to distance from the fourth semiconductor package by at least a second predetermined distance exceeding the first predetermined distance, and is disposed in a passage of the air taken in by the fan.

    Abstract translation: 一种用于车辆的电子设备包括:具有CPU的第一半导体封装的数字基板,具有可从CPU读取和写入的易失性存储器的第二半导体封装,具有闪存的第三半导体封装,其存储启动程序 CPU和具有电源管理集成电路的第四半导体封装; 以及风扇,其沿着安装有第一至第四半导体封装件的数字基板的表面吸入空气。 第三半导体封装被设置成距离第一半导体封装至少第一预定距离并且距离第四半导体封装的距离超过第一预定距离至少第二预定距离,并且设置在空气的通道中 被粉丝带走。

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