公开(公告)号：US20180269122A1

公开(公告)日：2018-09-20

申请号：US15907883

申请日：2018-02-28

Applicant: DENSO CORPORATION

Inventor： Yoshiki KATO ,  Yasuhiro ISHIMOTO

IPC: H01L23/16 ,  H01L23/31

CPC classification number: H01L23/16 ,  H01L21/563 ,  H01L23/3178 ,  H01L24/26

Abstract: A printed substrate having a first surface to which an electronic component is to be fixed through an underfill material includes a groove that is recessed from the first surface. The first surface includes a pair of lands that is to be electrically connected to the electronic component. The groove extends in a first direction in which the pair of lands extends and is located in a facing region of the first surface in which the first surface is to face the electronic component. An electronic device includes the printed substrate, the electronic component fixed to the first surface and the underfill material disposed between the first surface and the electronic component.

公开(公告)号：US20180006520A1

公开(公告)日：2018-01-04

申请号：US15607816

申请日：2017-05-30

Applicant: DENSO CORPORATION

Inventor： Yasuhiro ISHIMOTO ,  Kazuyuki WATANABE ,  Takuya MATSUYAMA

IPC: H02K5/08 ,  H02K11/30 ,  F16F9/30 ,  H01R12/71

CPC classification number: H02K5/08 ,  F16F9/306 ,  H01R12/716 ,  H02K5/225 ,  H02K9/22 ,  H02K11/30 ,  H02K11/33

Abstract: A printed circuit board and multiple components, which are mounted on both sides of the printed circuit board, form a circuit to drive a motor. The printed circuit board is opposed to a case at a one side. First thermal conductive portion is interposed between a heat generating component of the components and the case. Second thermal conductive portion is interposed between the circuit board and the case. The first and second thermal conductive portions are formed of the same flexible material, are equipped to the same side of the circuit board, are in contact with both the circuit board and the case, and are located at different positions.