公开(公告)号：US10668656B2

公开(公告)日：2020-06-02

申请号：US15543590

申请日：2016-01-19

Applicant: DENSO CORPORATION

Inventor： Atsushi Kawamura ,  Youhei Yoshimura ,  Tsuyoshi Arai ,  Yuka Hori ,  Mitsuhiro Suzuki

IPC: B29C45/40 ,  B29C45/26 ,  B29C45/56 ,  B29C45/77 ,  B29C44/58 ,  B29C45/80 ,  B29C45/28 ,  B29C33/20

Abstract: In a molding die, movable die elements are respectively received in die element receiving holes formed in a frame plate. An end surface of the frame plate, which faces a cavity at a location that is other than locations of the die element receiving holes, forms a frame portion compression surface. An end surface of each movable die element, which faces the cavity, forms a split compression surface. Die element drive devices respectively drive the split compression surfaces of the movable die elements. A whole compression plate commonly supports an opposite end part of the frame plate and opposite end parts of the movable die elements, which are opposite from the cavity. When the whole compression plate is moved forward, the whole compression plate integrally drives the frame plate and the movable die elements forward. A whole drive device drives the whole compression plate.