公开(公告)号：US20160104657A1

公开(公告)日：2016-04-14

申请号：US14892724

申请日：2014-06-18

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke ARAMAKI ,  Atsuya YOSHINARI ,  Takuhiro ISHII ,  Shin-ichi UCHIDA ,  Masahiko ITO ,  Syunsuke UCHIDA

IPC: H01L23/373

CPC classification number: H01L23/3737 ,  B29C47/0004 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/0066 ,  B29C47/8805 ,  B29C2035/0822 ,  B29K2995/0013 ,  C09K5/14 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 μm or less.

Abstract translation: 导热片，其包含：粘合剂; 碳纤维; 和无机填料，其中导热片被夹在半导体器件的热源和散热构件之间，其中碳纤维的平均纤维长度为50μm至250μm，其中热的热阻 导电片的负荷为7.5kgf / cm 2时，根据ASTM-D5470测定，小于0.17K·cm 2 / W，导热片的平均厚度为500μm以下。