专利检索 ap:("DIC Corporation") AND inv:"Kousuke IGAWA" 第 1 页

1.

发明公开
LIGHT-CURABLE RESIN COMPOSITION, FORMED RESIN PRODUCT, METHOD FOR PRODUCING MOLD AND METHOD FOR PRODUCING CASTED METAL PRODUCT 审中-公开

公开(公告)号：US20230416434A1

公开(公告)日：2023-12-28

申请号：US18035285

申请日：2021-11-04

申请人： DIC Corporation

发明人： Kousuke IGAWA , Shigetoshi NISHIZAWA

IPC分类号： C08F220/26 , C08F2/48 , B22C9/02

CPC分类号： C08F220/26 , C08F2/48 , B22C9/02

摘要： An object of the present invention is to provide a light-curable resin composition having reduced soot residue at the time of mold preparation and reduced occurrence of cracks and fractures. The present invention has found that a light-curable resin composition including a (meth)acrylate-based UV-curable resin (A) (with proviso that the following compound (B) is omitted), and a compound (B) having an alkylene glycol skeleton represented by a specific chemical formula in a structure allows the soot residue at the time of mold preparation to be reduced and occurrence of cracks and fractures to be reduced, whereby the above object is achieved.