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公开(公告)号：US09314895B2
公开(公告)日：2016-04-19
申请号：US14560017
申请日：2014-12-04
申请人： DISCO CORPORATION
发明人： Takashi Mori , Shinichi Namioka , Masaaki Nagashima , Hidetaka Ochi , Naoto Takata , Masaaki Suzuki , Hirotoshi Hoshikawa , Osamu Miura , Noriko Ito
CPC分类号： B24B7/228 , B24B41/005 , B24B57/02
摘要： A grinding apparatus for grinding a wafer stored in a cassette composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting waste water generated in grinding the wafer by operating the grinding unit.
摘要翻译： 一种用于研磨存储在由用于存储晶片的容器的盒中的晶片的研磨装置和用于封闭容器的盖。 研磨装置包括用于将盒子放置在其上的盒式工作台，盖拆卸单元，用于从放置在盒式桌子上的盒子中取出盖子，仅将容器留在盒式桌子上，用于将晶片保持在抽吸下的卡盘台， 用于将卡盘台移动到研磨区域的卡盘台移动单元，设置在研磨区域中的研磨单元，所述研磨单元具有用于研磨保持在卡盘台上的晶片的研磨轮，用于供给研磨水的研磨供水单元 砂轮的研磨部件和废水收集单元，用于通过操作磨削单元收集在研磨晶片时产生的废水。
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公开(公告)号：US20150158137A1
公开(公告)日：2015-06-11
申请号：US14560017
申请日：2014-12-04
申请人： DISCO CORPORATION
发明人： Takashi Mori , Shinichi Namioka , Masaaki Nagashima , Hidetaka Ochi , Naoto Takata , Masaaki Suzuki , Hirotoshi Hoshikawa , Osamu Miura , Noriko Ito
CPC分类号： B24B7/228 , B24B41/005 , B24B57/02
摘要： A grinding apparatus for grinding a wafer stored in a cassette is composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting a waste water generated in grinding the wafer by operating the grinding unit.
摘要翻译： 用于研磨存储在盒中的晶片的研磨装置由用于存储晶片的容器和用于封闭容器的盖组成。 研磨装置包括用于将盒子放置在其上的盒式工作台，盖拆卸单元，用于从放置在盒式桌子上的盒子中取出盖子，仅将容器留在盒式桌子上，用于将晶片保持在抽吸下的卡盘台， 用于将卡盘台移动到研磨区域的卡盘台移动单元，设置在研磨区域中的研磨单元，所述研磨单元具有用于研磨保持在卡盘台上的晶片的研磨轮，用于供给研磨水的研磨供水单元 到研磨轮的研磨部件，以及废水收集单元，用于通过操作研磨单元来收集在研磨晶片时产生的废水。
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公开(公告)号：US11565369B2
公开(公告)日：2023-01-31
申请号：US17178550
申请日：2021-02-18
申请人： DISCO CORPORATION
发明人： Masaaki Nagashima , Naoto Takata
摘要： A method of grinding a surface of a workpiece that has surface irregularities includes a first grinding step of grinding the surface of the workpiece by a predetermined amount of stock removal while keeping a measuring element of a height gauge out of contact with the surface of the workpiece, thereafter, a height difference measuring step of bringing the measuring element of the height gauge into contact with the surface of the workpiece and measuring a height difference of surface irregularities on the surface of the workpiece with the height gauge, and a second grinding step of, if the measured height difference is larger than a preset range, grinding the surface of the workpiece while keeping the measuring element of the height gauge in contact with the surface of the workpiece until the measured height difference falls within the preset range.
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