公开(公告)号：US20150158137A1

公开(公告)日：2015-06-11

申请号：US14560017

申请日：2014-12-04

申请人： DISCO CORPORATION

发明人： Takashi Mori ,  Shinichi Namioka ,  Masaaki Nagashima ,  Hidetaka Ochi ,  Naoto Takata ,  Masaaki Suzuki ,  Hirotoshi Hoshikawa ,  Osamu Miura ,  Noriko Ito

IPC分类号： B24B7/22 ,  B24B41/00 ,  B24B57/02

CPC分类号： B24B7/228 ,  B24B41/005 ,  B24B57/02

摘要： A grinding apparatus for grinding a wafer stored in a cassette is composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting a waste water generated in grinding the wafer by operating the grinding unit.

摘要翻译： 用于研磨存储在盒中的晶片的研磨装置由用于存储晶片的容器和用于封闭容器的盖组成。 研磨装置包括用于将盒子放置在其上的盒式工作台，盖拆卸单元，用于从放置在盒式桌子上的盒子中取出盖子，仅将容器留在盒式桌子上，用于将晶片保持在抽吸下的卡盘台， 用于将卡盘台移动到研磨区域的卡盘台移动单元，设置在研磨区域中的研磨单元，所述研磨单元具有用于研磨保持在卡盘台上的晶片的研磨轮，用于供给研磨水的研磨供水单元 到研磨轮的研磨部件，以及废水收集单元，用于通过操作研磨单元来收集在研磨晶片时产生的废水。

公开(公告)号：US20160368069A1

公开(公告)日：2016-12-22

申请号：US15184643

申请日：2016-06-16

申请人： DISCO CORPORATION

发明人： Masayuki Matsubara ,  Masaaki Suzuki ,  Seiki Fuchiyama

IPC分类号： B23H7/10 ,  B24B27/06 ,  B28D5/04 ,  B23H7/06

CPC分类号： B23H7/104 ,  B23D57/0053 ,  B23D57/0061 ,  B23H1/028 ,  B23H7/06 ,  B23H7/105 ,  B24B27/0633 ,  B28D5/045

摘要： Disclosed herein is a multi-wire saw including a wire, a set of guide rollers, an adjusting unit for adjusting tension of the wire wrapped around the guide rollers, a fixing base for fixing a workpiece to be cut by the wire wrapped around the guide rollers, and a moving mechanism for moving the workpiece fixed to the fixing base toward the wire. The adjusting unit includes an adjust roller around which the wire is wrapped, a rotational speed control section for controlling the rotational speed of the adjust roller, and a supply roller around which the wire is wrapped to be supplied to the adjust roller. The supply roller is provided with a wire shifting mechanism for suitably changing the axial position of the wire in the axial direction of the supply roller to thereby prevent the axial position of the wire wrapped around the adjust roller from being fixed.

摘要翻译： 这里公开了一种多线锯，其包括线，一组导辊，用于调节缠绕在导向辊周围的线的张力的调节单元，用于固定待缠绕在导向器上的线的待切割工件的固定基座 以及用于将固定到固定基座上的工件朝向线移动的移动机构。 所述调整单元包括调节辊，所述线被卷绕在所述调节辊上，用于控制所述调节辊的旋转速度的转速控制部和供给辊，所述供给辊围绕所述供给辊缠绕以供给所述调节辊。 供给辊设置有用于适当地改变供应辊的轴向方向上的线的轴向位置的线移动机构，从而防止缠绕在调节辊上的线的轴向位置被固定。

公开(公告)号：US09314895B2

公开(公告)日：2016-04-19

申请号：US14560017

申请日：2014-12-04

申请人： DISCO CORPORATION

发明人： Takashi Mori ,  Shinichi Namioka ,  Masaaki Nagashima ,  Hidetaka Ochi ,  Naoto Takata ,  Masaaki Suzuki ,  Hirotoshi Hoshikawa ,  Osamu Miura ,  Noriko Ito

IPC分类号： B24B7/22 ,  B24B41/00 ,  B24B57/02

CPC分类号： B24B7/228 ,  B24B41/005 ,  B24B57/02

摘要： A grinding apparatus for grinding a wafer stored in a cassette composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting waste water generated in grinding the wafer by operating the grinding unit.

摘要翻译： 一种用于研磨存储在由用于存储晶片的容器的盒中的晶片的研磨装置和用于封闭容器的盖。 研磨装置包括用于将盒子放置在其上的盒式工作台，盖拆卸单元，用于从放置在盒式桌子上的盒子中取出盖子，仅将容器留在盒式桌子上，用于将晶片保持在抽吸下的卡盘台， 用于将卡盘台移动到研磨区域的卡盘台移动单元，设置在研磨区域中的研磨单元，所述研磨单元具有用于研磨保持在卡盘台上的晶片的研磨轮，用于供给研磨水的研磨供水单元 砂轮的研磨部件和废水收集单元，用于通过操作磨削单元收集在研磨晶片时产生的废水。