公开(公告)号：US20230071868A1

公开(公告)日：2023-03-09

申请号：US17821347

申请日：2022-08-22

申请人： DISCO CORPORATION

发明人： Yoshiaki SHIMIZU

IPC分类号： H01L21/268 ,  B23K26/50

摘要： There is provided a diamond wafer dividing method used when the diamond wafer having a front surface along the {100} plane is divided at planned dividing lines along the direction. The dividing method includes a first modified layer forming step of forming a first modified layer at a linear first region along the planned dividing line, inside the diamond wafer, a second modified layer forming step of forming a second modified layer at a linear second region shifted from the first region in the width direction and the thickness direction with respect to the front surface, and a dividing step of dividing the diamond wafer along the planned dividing lines by giving a force to the diamond wafer in which the first modified layer and the second modified layer are formed.