ELECTRONIC ASSEMBLY HAVING THERMAL PAD WITH POLYMER LAYER

    公开(公告)号:US20230345675A1

    公开(公告)日:2023-10-26

    申请号:US17729174

    申请日:2022-04-26

    CPC classification number: H05K7/2039

    Abstract: An electronic assembly is provided. The electronic assembly includes a heat-spreader component and at least one spring. The electronic assembly further includes a thermal pad contacting the at least one spring, and at least one layer of polymer directly contacting at least one of an upper surface and a lower surface of the thermal pad. Further disclosed is a method of assembling the electronic assembly. The method includes adhering a heat-dissipating sheet on a surface of a metal heat-spreader component. The method also includes placing a thermal pad on at least one spring extending from the surface of the metal heat-spreader component, and placing at least one layer of polymer so as to directly contact at least one of an upper surface and a lower surface of the thermal pad.

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