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公开(公告)号:US20180311733A1
公开(公告)日:2018-11-01
申请号:US15725136
申请日:2017-10-04
Applicant: DIVERGENT TECHNOLOGIES, INC.
Inventor: Muhammad Faizan ZAFAR , Broc William TenHOUTEN , Antonio Bernerd MARTINEZ , Keith Allen FLEMING , John Russell BUCKNELL
IPC: B22F3/105 , B22F3/10 , B23K26/142 , B23K26/342 , B23K26/70 , B22F3/18 , B22F3/16 , B22F3/02
Abstract: Systems and methods of support structures in powder-bed fusion (PBF) are provided. Support structures can be formed of bound powder, which can be, for example, compacted powder, compacted and sintered powder, powder with a binding agent applied, etc. Support structures can be formed of non-powder support material, such as a foam. Support structures can be formed to include inductive components that can be used to facilitate removal of the support structures in the presence of an external magnetic field. Additionally, support structures can be formed to break when a fluid, such as air or water, creates a force and/or pressure at a connection point interface.
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公开(公告)号:US20190039138A1
公开(公告)日:2019-02-07
申请号:US16155379
申请日:2018-10-09
Applicant: DIVERGENT TECHNOLOGIES, INC.
Inventor: Muhammad Faizan ZAFAR , Broc William TenHOUTEN , Antonio Bernerd MARTINEZ , Keith Allen FLEMING , John Russell BUCKNELL
IPC: B22F3/105 , B22F3/10 , B33Y30/00 , B33Y50/02 , B23K26/142 , B23K26/342 , B23K26/70 , B22F3/18 , B22F3/16 , B33Y10/00 , B22F3/02 , B29C64/386
Abstract: Systems and methods of support structures in powder-bed fusion (PBF) are provided. Support structures can be formed of bound powder, which can be, for example, compacted powder, compacted and sintered powder, powder with a binding agent applied, etc. Support structures can be formed of non-powder support material, such as a foam. Support structures can be formed to include inductive components that can be used to facilitate removal of the support structures in the presence of an external magnetic field. Additionally, support structures can be formed to break when a fluid, such as air or water, creates a force and/or pressure at a connection point interface.
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