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公开(公告)号：US20210071836A1
公开(公告)日：2021-03-11
申请号：US17085636
申请日：2020-10-30
申请人： DMF, Inc.
摘要： An LED lighting apparatus comprises a housing having at least one sidewall, an LED board, a lens having a back side facing the LED board and a front side opposite to the back side, and a driver module cover. The lens is disposed with respect to the LED board such that the plurality of the LEDs illuminate the back side of the lens. An adapter bracket is employed to couple the LED lighting apparatus to a junction box installed and positioned above the ceiling such that when the apparatus is snapped into the junction box, the driver module cover is at least partially disposed in the junction box.
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公开(公告)号：US20180372284A1
公开(公告)日：2018-12-27
申请号：US16016040
申请日：2018-06-22
申请人： DMF, Inc.
IPC分类号： F21S8/04 , F21S8/00 , F21K9/68 , F21V21/088
摘要： A thin profile surface mount LED lighting apparatus includes a housing, an LED board including multiple uniformly distributed LEDs, and a lens. The lens has a back side facing the LED board and a front side that provides a downward facing surface when the LED lighting apparatus is installed in an opening of a ceiling. The lens is disposed with respect to the LED board such that the LEDs illuminate the back side of the lens. A first spacing of the LEDs causes resulting light from the downward facing surface of the lens to be substantially uniform during operation of the apparatus. In one example, a thin front edge of a sidewall of the housing, forming a perimeter around the lens, is flush with the lens and is appreciably thin (e.g., a thickness of less than three millimeters), and a depth of the sidewall housing is less than one inch.
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公开(公告)号：US20210010647A1
公开(公告)日：2021-01-14
申请号：US16881686
申请日：2020-05-22
申请人： DMF, Inc.
摘要： An LED downlighting apparatus includes a housing with a sidewall having a front facing edge and a back facing edge positioned adjacent to a ceiling when the LED downlighting apparatus is installed in an opening of the ceiling. A depth of the sidewall is less than one inch and a thickness of at least a portion of the sidewall is less than three millimeters. An LED board and a lens are coupled to the housing. The lens is disposed with respect to the LED board such that the lens is illuminated from a back side. One or more mechanical couplers snap fit the apparatus to a junction box installed and positioned above the ceiling such that when the apparatus is snap fit to the junction box through the opening of the ceiling, the housing appears to be surface mounted to the ceiling.
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公开(公告)号：US11293609B2
公开(公告)日：2022-04-05
申请号：US16881686
申请日：2020-05-22
申请人： DMF, Inc.
IPC分类号： F21S8/04 , F21S8/00 , F21V21/088 , F21K9/68 , F21S8/02 , F21S9/02 , F21Y115/10 , F21Y105/16 , F21Y105/18 , F21V21/04 , F21V8/00 , F21V29/87 , F21V23/04
摘要： An LED downlighting apparatus includes a housing with a sidewall having a front facing edge and a back facing edge positioned adjacent to a ceiling when the LED downlighting apparatus is installed in an opening of the ceiling. A depth of the sidewall is less than one inch and a thickness of at least a portion of the sidewall is less than three millimeters. An LED board and a lens are coupled to the housing. The lens is disposed with respect to the LED board such that the lens is illuminated from a back side. One or more mechanical couplers snap fit the apparatus to a junction box installed and positioned above the ceiling such that when the apparatus is snap fit to the junction box through the opening of the ceiling, the housing appears to be surface mounted to the ceiling.
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公开(公告)号：US11047538B2
公开(公告)日：2021-06-29
申请号：US17085636
申请日：2020-10-30
申请人： DMF, Inc.
IPC分类号： F21S8/04 , F21S8/00 , F21V21/088 , F21K9/68 , F21S8/02 , F21S9/02 , F21Y115/10 , F21Y105/16 , F21Y105/18 , F21V21/04 , F21V8/00 , F21V29/87 , F21V23/04
摘要： An LED lighting apparatus comprises a housing having at least one sidewall, an LED board, a lens having a back side facing the LED board and a front side opposite to the back side, and a driver module cover. The lens is disposed with respect to the LED board such that the plurality of the LEDs illuminate the back side of the lens. An adapter bracket is employed to couple the LED lighting apparatus to a junction box installed and positioned above the ceiling such that when the apparatus is snapped into the junction box, the driver module cover is at least partially disposed in the junction box.
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公开(公告)号：US20220003367A1
公开(公告)日：2022-01-06
申请号：US17477503
申请日：2021-09-16
申请人： DMF, Inc.
摘要： An LED downlighting apparatus includes a housing with a sidewall having a front facing edge and a back facing edge positioned adjacent to a ceiling when the LED downlighting apparatus is installed in an opening of the ceiling. A depth of the sidewall is less than one inch and a thickness of at least a portion of the sidewall is less than three millimeters. An LED board and a lens are coupled to the housing. The lens is disposed with respect to the LED board such that the lens is illuminated from a back side. One or more mechanical couplers snap fit the apparatus to a junction box installed and positioned above the ceiling such that when the apparatus is snap fit to the junction box through the opening of the ceiling, the housing appears to be surface mounted to the ceiling.
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公开(公告)号：US10663127B2
公开(公告)日：2020-05-26
申请号：US16653497
申请日：2019-10-15
申请人： DMF, Inc.
IPC分类号： F21S8/04 , F21S8/00 , F21V21/088 , F21K9/68 , F21S8/02 , F21S9/02 , F21Y115/10 , F21Y105/16 , F21Y105/18 , F21V21/04 , F21V8/00 , F21V29/87 , F21V23/04
摘要： A thin profile surface mount LED lighting apparatus includes a housing, an LED board including multiple LEDs, and a lens. The lens has a back side facing the LED board and a front side that provides a downward facing surface when the LED lighting apparatus is installed in an opening of a ceiling. The lens is disposed with respect to the LED board such that the LEDs illuminate the back side of the lens. A first spacing of the LEDs causes resulting light from the downward facing surface of the lens to be substantially uniform during operation of the apparatus. In one example, a thin front edge of a sidewall of the housing, forming a perimeter around the lens, is flush with the lens and is appreciably thin (e.g., a thickness of less than three millimeters), and a depth of the sidewall housing is less than one inch.
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公开(公告)号：US20200056752A1
公开(公告)日：2020-02-20
申请号：US16653497
申请日：2019-10-15
申请人： DMF, Inc.
摘要： A thin profile surface mount LED lighting apparatus includes a housing, an LED board including multiple LEDs, and a lens. The lens has a back side facing the LED board and a front side that provides a downward facing surface when the LED lighting apparatus is installed in an opening of a ceiling. The lens is disposed with respect to the LED board such that the LEDs illuminate the back side of the lens. A first spacing of the LEDs causes resulting light from the downward facing surface of the lens to be substantially uniform during operation of the apparatus. In one example, a thin front edge of a sidewall of the housing, forming a perimeter around the lens, is flush with the lens and is appreciably thin (e.g., a thickness of less than three millimeters), and a depth of the sidewall housing is less than one inch.
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