公开(公告)号：US20230027838A1

公开(公告)日：2023-01-26

申请号：US17782452

申请日：2020-12-04

Applicant: DOOSAN CORPORATION

Inventor： Taejin CHOI ,  Sooin PARK

IPC: C09J7/35 ,  C09J5/06 ,  H01L23/00

Abstract: An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

公开(公告)号：US20220199430A1

公开(公告)日：2022-06-23

申请号：US17404009

申请日：2021-08-17

Applicant: DOOSAN CORPORATION

Inventor： Taejin CHOI ,  Chunggu LEE ,  Sooin PARK ,  Jungjin LEE

IPC: H01L21/56 ,  C09J7/40 ,  C09J163/00 ,  C09J7/38 ,  H01L23/00

Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.