公开(公告)号：US20240318000A1

公开(公告)日：2024-09-26

申请号：US18578070

申请日：2021-07-14

Applicant: DOW SILICONES CORPORATION ,  DOW GLOBAL TECHNOLOGIES LLC

Inventor： Yan HUANG ,  Dorab BHAGWAGAR ,  Linfei WANG ,  Zhongwei CAO

IPC: C08L83/04 ,  C08K3/22 ,  C08K9/06

CPC classification number: C08L83/04 ,  C08K3/22 ,  C08K9/06 ,  C08K2003/2227 ,  C08K2201/005 ,  C08L2205/025 ,  C08L2205/035

Abstract: This disclosure relates to a thermal conductive silicone composition. The composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule and having a viscosity at 25° C. of from 10 to 10,000 mPa·s measured using a type B viscometer according to ASTM D 1084, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, (C) a specific adhesion promoter, (D) at least one thermal conductive filler, (E) at least one filler treating agent, and (F) a hydrosilylation reaction catalyst, with the proviso that the composition does not contain a condensation catalyst. The composition exhibits good self-adhesive properties to various substrates even when it is cured at a relatively low temperature, without impairing its flowability.

公开(公告)号：US20210269643A1

公开(公告)日：2021-09-02

申请号：US17253744

申请日：2018-06-27

Applicant: DOW SILICONES CORPORATION

Inventor： Yan ZHENG ,  Zhongwei CAO ,  Qiang HUANG ,  Rui YANG ,  Sandrine TEIXEIRA de CARVALHO ,  Lujing XIE

IPC: C08L83/04 ,  C08K5/00 ,  H01M10/625 ,  H01M10/66

Abstract: A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.